Recessed Heat Sink with Discernible Component for Enclosure

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Solution Overview

Problem

Existing enclosures for heat-generating circuitry require excessive amounts of thermal interface material (TIM) to facilitate heat dissipation, which increases costs and reduces efficiency.

Innovation Solution

A finned heat sink with a discernible component is integrated into the enclosure, featuring a recessed design that reduces the need for TIM while enhancing heat dissipation through increased surface area and a recognizable image for differentiation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If a conventional heat sink is used in the enclosure, then heat dissipation is provided, but the amount of thermal interface material (TIM) required increases excessively

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidamount of TIM

Core Design Contradiction:

Loss of energyVSQuantity of substance

Solution Approach 1:

The patent combines the heat sink structure with the enclosure housing into a unified integrated component. The heat sink is formed as an integral part of the enclosure with fins extending from the housing walls, eliminating the need for separate heat sink assemblies and excessive TIM application while maintaining effective heat dissipation from the circuit board

Inventive Principle:

Principle #5Merging (Combining)

2Loss of energy

If a conventional heat sink design is used, then heat dissipation is achieved, but the enclosure lacks visual differentiation and brand identity

Engineering Contradiction:

Improveheat dissipationVSAvoidvisual differentiation capability

Core Design Contradiction:

Loss of energyVSDevice complexity

Solution Approach 1:

The integrated heat sink structure serves multiple functions simultaneously: it provides thermal management through finned heat dissipation surfaces and acts as a branding element by incorporating recessed logo areas that receive distinct coatings or finishes. This multi-functionality eliminates the need for separate branding components while maintaining heat dissipation effectiveness

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Loss of energy

If excessive TIM is used to facilitate heat dissipation, then thermal transfer is improved, but production costs increase

Engineering Contradiction:

Improvethermal transfer efficiencyVSAvoidproduction cost

Core Design Contradiction:

Loss of energyVSEase of manufacture

Solution Approach 1:

The patent extracts the heat dissipation function from the TIM-dependent interface and relocates it to the integrated heat sink fins that extend directly from the enclosure walls. This extraction reduces reliance on TIM layers and their associated application costs while maintaining effective thermal transfer from the circuit board to the surrounding environment

Inventive Principle:

Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces the amount of TIM needed, lowers production costs, and improves thermal dissipation efficiency by utilizing a heat sink with a discernible component that promotes heat transfer and visual differentiation.

Implementation Method 1

The heat sink arranged on the first outer surface includes a plurality of protrusions, each of the protrusions extending outward from the first outer surface... to promote heat dissipation of the enclosure

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

provide heat dissipation by use of a heat sink with a discernible component... promote thermal transfer from heat-generating circuitry to the first outer surface and the second outer surface

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 3

The TIM is disposed in TIM layers, each of which is thermally conductive and arranged between the circuitry and the first outer surface and the second outer surface. The TIM layers are used to transfer heat generated from the circuitry to the first outer surface and the second outer surface

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250126755A1Recessed heat sink with a discernible component as part of a device enclosure

Publication Date: 2025.04.17 SK HYNIX NAND PRODUCT SOLUTIONS CORP

AI summary

An enclosure, a related method for manufacturing thereof, and a device which includes thereof are disclosed herein. The enclosure includes a first outer surface and a second outer surface opposing the first outer surface. The enclosure further includes a heat sink arranged on the first outer surface, the heat sink including a plurality of protrusions extending outward from the first outer surface and a discernible component. The discernible component protrudes from the first outer surface and is recessed from the plurality of protrusions. The discernible component is distinguishable from the protrusions. The enclosure is to enclose circuitry between the first outer surface and the second outer surface, such that the circuitry is arranged closer to the second outer surface than to the first outer surface.