Recessed Interconnect Substrate for Wider Component Mounting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing interconnect substrates with recesses reduce the available area for mounting electronic components due to the space occupied by the recess.
Innovation Solution
An interconnect substrate design featuring a first and second interconnect substrate with a connector inside a recess, an intermediate substrate with conductive vias, and conductive members connecting electrodes and vias, allowing for a wide area for component mounting and reduced substrate height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a recess is formed in the substrate to accommodate a connector, then the connector can be integrated into the substrate structure, but the area available for mounting electronic components is reduced
Solution Approach 1:
The connector is positioned in the depth direction (Z-axis) within the recess rather than occupying planar space, utilizing the third dimension to accommodate the connector while preserving the two-dimensional mounting area on the substrate surface
2Area of stationary object
If the substrate structure is simplified without a recess, then the component mounting area is maximized, but the connector integration and electrical connectivity become more complex
Solution Approach 1:
An intermediate substrate with conductive vias acts as a mediator between the connector and the second interconnect substrate, enabling electrical connectivity through the recess structure while allowing the connector to be positioned within the recess without direct attachment to the second substrate
3Reliability
If conductive members are used to connect electrodes and vias, then electrical connectivity is ensured, but the number of components and assembly steps increase
Solution Approach 1:
The first and second conductive members are positioned on opposite sides of the intermediate substrate to simultaneously connect the first electrode to the conductive via and the second electrode to the conductive via, achieving complete electrical connectivity through a single integrated assembly operation
Data Source
AI summary
An interconnect substrate includes a first interconnect substrate having a first electrode on a first surface and having a recess formed in an edge in a plan view normal to the first surface, a second interconnect substrate having a second electrode on a second surface facing toward the first surface, a connector disposed inside the recess and electrically connected to the first interconnect substrate, an intermediate substrate disposed between the first interconnect substrate and the second interconnect substrate, the intermediate substrate including an insulating base and a conductive via, the insulating base having a through hole extending from a third surface facing the first surface to a fourth surface facing the second surface, the conductive via being disposed in the through hole, a first conductive member electrically connecting the first electrode and the conductive via, and a second conductive member electrically connecting the second electrode and the conductive via.