Recessed Interconnects for Surface Mounted Passive Components
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrates for surface mounted passive components in integrated devices face challenges with space efficiency and unintended solder joint formation, leading to increased component thickness and shorting issues.
Innovation Solution
The substrate incorporates a dielectric layer with cavities and solder interconnects located within these cavities, allowing for a more compact passive component placement and reducing the likelihood of shorting by containing solder overflow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If solder interconnects are placed on the surface of the substrate to mount a passive component, then the passive component can be coupled to the substrate, but the component thickness increases and space is wasted
Solution Approach 1:
The solder interconnect is nested within a cavity formed in the dielectric layer of the substrate. This allows the solder interconnect to be embedded inside the substrate rather than protruding from the surface, thereby reducing the overall height and space occupied by the mounted passive component while maintaining the electrical connection functionality.
2Reliability
If solder interconnects are placed on the substrate surface, then the passive component can be mounted, but unintended solder joints may occur between adjacent interconnects
Solution Approach 1:
The solder interconnect is embedded within a cavity in the dielectric layer, which physically isolates it from adjacent interconnects. This nested configuration prevents solder bridging and unintended joints between adjacent interconnects, thereby improving reliability without requiring complex additional structures.
Solution Approach 2:
The dielectric layer acts as an intermediary material that fills and surrounds the cavity containing the solder interconnect. This dielectric medium provides electrical insulation between adjacent interconnects, preventing shorting while maintaining a relatively simple substrate structure.
3Length of stationary object
If the substrate uses conventional surface mounting, then passive components can be attached, but the overall device height increases
Solution Approach 1:
The solder interconnect is nested within a cavity formed in the dielectric layer of the substrate. This embedding approach allows the solder interconnect to occupy space within the substrate volume rather than extending beyond the substrate surface, thereby reducing the overall device height while maintaining functional connectivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration minimizes the overall space occupied by the passive component and prevents unintended solder joints, enabling a thinner, higher capacitance value component with reduced risk of shorting.
Implementation Method 1
The solder interconnect is located within the dielectric layer
Data Source
AI summary
A device that includes a substrate, a die, and a discrete capacitor. The substrate includes a dielectric layer and a plurality of interconnects formed in the dielectric layer. The discrete capacitor is coupled to the substrate through a first solder interconnect and a second solder interconnect. The first solder interconnect and the second solder interconnect are located within the dielectric layer. The die is coupled to the substrate. In some implementations, the first solder interconnect is located in a first cavity of the dielectric layer, and the second solder interconnect is located in a second cavity of the dielectric layer. In some implementations, the substrate includes a first cavity that is filled with a first via and the first solder interconnect; and a second cavity that is filled with a second via and the second solder interconnect.