Recessed Interposer Structure for Fine-Pitch Semiconductor Packaging
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Solution Overview
Problem
The development of compact and multifunctional electronic equipment requires advanced semiconductor packages that efficiently connect highly integrated semiconductor chips, but existing interposers and semiconductor packages face challenges in achieving high-density connector arrangements and optimal data transmission performance.
Innovation Solution
The semiconductor package design incorporates an interposer with a central portion on the semiconductor chip and an outer portion contacting the conductive connector, featuring a recessed structure and varying thicknesses to accommodate a fine pitch of conductive connectors, enhancing data transmission performance and reducing package thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the interposer uses a uniform thickness structure, then the manufacturing process is simple, but it cannot accommodate fine pitch conductive connectors and achieve high-density arrangements
Solution Approach 1:
The interposer employs varying thickness design where the first region (central portion) has a first thickness and the second region (outer portion) has a second thickness different from the first. This local quality variation enables different regions to serve different functions: the thinner central region accommodates fine pitch conductive connectors for high-density arrangements, while the thicker outer region provides structural support and mounting area for semiconductor chips, thus resolving the contradiction between manufacturing precision and device complexity.
2Strength
If the interposer thickness is increased to provide structural support, then the mechanical strength is improved, but the overall package thickness increases
Solution Approach 1:
The interposer is segmented into two distinct regions with different thicknesses: a first region with a first thickness and a second region with a second thickness. This segmentation allows the structure to optimize both strength and thickness - the thicker second region provides necessary structural support and mounting area, while the thinner first region reduces overall package thickness in the critical connection area, thus resolving the contradiction between strength and package thickness.
3Productivity
If conductive connectors are arranged at fine pitch for high density, then the data transmission performance is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The interposer's first region is designed with a specific thickness optimized for fine pitch conductive connector arrangements. This localized thickness optimization in the central portion provides the necessary mechanical support and electrical performance for high-density connector arrangements, enabling improved data transmission efficiency while maintaining feasible manufacturing precision requirements through the tailored local structure.
Data Source
AI summary
A semiconductor package includes a first package substrate; a first semiconductor chip on the first package substrate; a first conductive connector on the first package substrate; and an interposer including a central portion on the first semiconductor chip and an outer portion having the first conductive connector attached thereto. The central portion of the interposer includes a bottom surface defining a recess from a bottom surface of the outer portion of the interposer in a vertical direction that is perpendicular to a top surface of the first package substrate. A thickness in the vertical direction of the outer portion of the interposer is greater than a thickness in the vertical direction of the central portion of the interposer.