Recessed LED Fixture Thermal Management via MCPCB

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Solution Overview

Problem

Recessed LED lighting fixtures face challenges with heat management, particularly when installed in enclosed spaces or ceilings, where elevated ambient temperatures exacerbate heat buildup, reducing LED lifespan and lumens output, and conventional bulky heat sinks are often required for cooling.

Innovation Solution

The design employs a Metal Core Printed Circuit Board (MCPCB) with LEDs clustered towards the center, copper conductor paths for thermal dissipation, and a reflector trim with thermal conductivity, eliminating the need for a secondary heat sink by maximizing thermal conduction and convective cooling through an oversized PCB and strategically placed thermal and electrical paths.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional heat sinks are used for cooling LEDs, then heat dissipation is improved, but device complexity and material costs increase

Engineering Contradiction:
Improveheat dissipationVSAvoiddevice complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent combines the PCB substrate with heat dissipation functions by integrating copper conductor paths that serve both electrical connectivity and thermal conduction purposes. The PCB itself becomes a primary heat dissipation component, merging the functions of electrical circuit support and thermal management into a single integrated structure, thereby eliminating the need for separate secondary heat sink components.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The copper conductor paths on the PCB serve multiple functions: they provide electrical connectivity between LEDs and power supply, and simultaneously act as thermal conduction pathways to dissipate heat from LED junctions. This multi-functionality reduces the overall component count and simplifies the thermal management system.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Temperature

If conventional heat sinks are used for cooling LEDs, then heat dissipation is improved, but manufacturing costs increase

Engineering Contradiction:
Improveheat dissipationVSAvoidmanufacturing costs
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The patent combines the PCB substrate with heat dissipation functions by integrating copper conductor paths that serve both electrical connectivity and thermal conduction purposes. The PCB itself becomes a primary heat dissipation component, merging the functions of electrical circuit support and thermal management into a single integrated structure, thereby eliminating the need for separate secondary heat sink components.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent extracts the secondary heat sink component from the traditional LED cooling system and replaces it with the PCB's own thermal conduction capabilities. By taking out the separate heat sink and utilizing the PCB's copper paths and metal core, the design reduces component count and manufacturing complexity.

Inventive Principle:
Principle #2Taking out (Extraction)

3Adaptability or versatility

If LEDs are mounted in enclosed ceiling spaces, then installation flexibility is improved, but heat buildup increases reducing LED lifespan

Engineering Contradiction:
Improveinstallation flexibilityVSAvoidheat buildup
Core Design Contradiction:
Adaptability or versatilityVSTemperature

Solution Approach 1:

The PCB serves itself as both the electrical circuit board and the primary heat dissipation system. The copper conductor paths and metal core PCB automatically conduct heat away from LED junctions without requiring external active cooling systems, enabling the LEDs to be installed in enclosed ceiling spaces while maintaining acceptable operating temperatures through passive thermal management.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The copper conductor paths act as thermal intermediaries, transferring heat from the LED junctions through the PCB substrate to the surrounding environment. This intermediary thermal conduction pathway enables effective heat management in enclosed installations where direct air cooling is limited.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively reduces temperature differentials, enhances heat dissipation, and increases the lifespan of LEDs while reducing material and manufacturing costs by eliminating the need for bulky heat sinks, ensuring efficient cooling and long duty life.

Implementation Method 1

The LEDs are connected by paths of electrical and thermal conductor material

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the reflector trim includes a material with a thermal conductivity of 2 W/m-K through 49 W/m-K inclusive, and includes a minimum reflectivity of 20%

Methodology Applied
Scientific EffectLight reflection: Reflection

Data Source

PatentUS10408444B2Recessed LED light fixture without secondary heat sink
Publication Date: 2019.09.10 CORDELIA LIGHTING
  • US10408444B2 patent drawing
  • US10408444B2 patent drawing
  • US10408444B2 patent drawing

AI summary

A recessed LED light fixture without need for a bulky, finned, metal heat sink. The recessed LED light fixture includes a Metal Core Printed Circuit Board (MCPCB) holding an array of LEDs that are arrange at the center thereof, and mounted to the printed circuit board using patterns of electrical and greases used to conduct a current and radiate heat. A mounting bracket holds the entire assembly for the light fixture together while spacing the LED driver and printed circuit board apart for further cooling, and wherein the upper side of the printed circuit board is exposed to the ambient air inside the housing.