Recessed LED Package Layout for Full-Color Microdisplay Assembly
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Solution Overview
Problem
Existing display devices employing light emitting diodes (LEDs) face challenges in achieving high-resolution, full-color displays with high color purity and reproducibility, while also requiring a simplified manufacturing process.
Innovation Solution
A light emitting device package is designed with a simple structure, featuring a base substrate with recessed portions, outer electrodes, a light emitting device with epitaxial stacks emitting different wavelength bands, and connection electrodes. This configuration allows for efficient light emission and easy manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple individually grown LED structures are formed on a final substrate to achieve high-resolution and full-color display, then display resolution and color capability are improved, but manufacturing process complexity increases
Solution Approach 1:
The invention divides the manufacturing process into two independent stages: first, growing LED structures on separate first substrates; second, transferring them to a final substrate. This segmentation allows each stage to be optimized independently, reducing overall process complexity while maintaining high display resolution
Solution Approach 2:
The LED structures are preliminarily grown and prepared on first substrates before being transferred to the final substrate. This preliminary action enables the LED structures to be manufactured under optimized conditions separately, then integrated into the final display device, simplifying the overall manufacturing process
2Adaptability or versatility
If multiple individually grown LED structures are formed on a final substrate to achieve full-color display, then color capability is improved, but manufacturing process complexity increases
Solution Approach 1:
Different colored LED structures (red, green, blue) are grown on separate first substrates and then transferred to the final substrate in specific arrangements. This segmentation enables full-color capability while simplifying manufacturing by allowing each color to be optimized independently during the growth stage
Solution Approach 2:
The first substrates serve multiple functions: they act as growth substrates for LED structures, temporary holding platforms during transfer, and alignment references for positioning on the final substrate. This multi-functionality reduces the need for additional specialized components and processes
3Ease of manufacture
If LED structures are transferred from first substrates to final substrate, then manufacturing process is simplified, but connection reliability between LED structures and final substrate may be compromised
Solution Approach 1:
Bump electrodes serve as intermediary connection elements between the LED structures and the final substrate. These bump electrodes are formed on both the LED structures and the final substrate, creating reliable electrical and mechanical connections that maintain signal integrity after transfer
Solution Approach 2:
Connection structures (bump electrodes) are preliminarily formed on both the LED structures and the final substrate before the transfer process. This preliminary preparation ensures that when the LED structures are transferred, reliable connections are already in place, maintaining connection reliability while enabling process simplification
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the production of high-resolution, full-color display devices with improved color purity and reproducibility, while simplifying the manufacturing process and enhancing light emitting efficiency.
Implementation Method 1
structures of red, green, and blue light emitting diodes, which are individually grown
Implementation Method 2
a light emitting structure disposed on the substrate, and a plurality of bump electrodes disposed on the substrate
Data Source
AI summary
A display device including a base substrate having a front surface and a rear surface, and including a first recess portion recessed from the front surface, a plurality of outer electrodes disposed on the base substrate, a light emitting device disposed in the first recess portion and configured to emit light in a direction away from the base substrate, the light emitting device including a light emitting structure electrically connected to the outer electrodes.