Recessed LED Circuit Substrate for Thin Backlight Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Direct-lighting type backlight systems for liquid crystal display devices face challenges in reducing thickness due to the large size of the light source unit and increased heat generation, which affects light emission efficiency and requires cooling mechanisms.
Innovation Solution
The integration of light sources into a circuit substrate, where at least part of the light source overlaps the substrate in the thickness direction, reduces the thickness of the light source unit and enhances heat dissipation by exposing the light source's bottom to the rear surface, allowing for improved cooling and a flattened front surface for assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the light source is mounted on the front surface of the circuit substrate, then the electrical connection is simplified, but the thickness of the light source unit increases and heat dissipation is reduced
Solution Approach 1:
The patent inverts the conventional mounting approach by placing the light source on the rear surface of the circuit substrate instead of the front surface. This inversion allows the light emitting surface to face the front surface of the substrate while the mounting location provides better heat dissipation and reduced thickness profile, effectively resolving the contradiction between simplified electrical connection and thickness reduction.
Solution Approach 2:
The patent utilizes the thickness dimension of the circuit substrate by recessing the light source into the substrate body. This dimensional approach allows the light source to be positioned at a depth that reduces the overall thickness of the light source unit while maintaining proper electrical connections through conductive structures within the substrate.
2Illumination intensity
If more light sources are used to increase luminance, then the brightness is improved, but the heat generation increases and light emission efficiency decreases
Solution Approach 1:
The patent extracts the heat dissipation function from the conventional mounting structure by providing a dedicated heat dissipation structure that is separately configured from the light source mounting. This heat dissipation structure includes thermal conductive materials and heat sinks that are specifically designed to remove heat from the light sources, allowing multiple light sources to operate at high luminance without excessive heat accumulation.
Solution Approach 2:
The patent employs composite material structures in the heat dissipation system, combining thermal conductive materials with heat radiating surfaces. The circuit substrate itself may incorporate thermally conductive layers or coatings that work in conjunction with external heat sinks to create a multi-material heat management system capable of handling the thermal load from multiple high-luminance light sources.
3Length of stationary object
If the light source is recessed into the circuit substrate, then the thickness is reduced and heat dissipation is improved, but the electrical connection becomes more complex
Solution Approach 1:
The patent merges the electrical connection function with the heat dissipation structure by integrating conductive pathways into the heat dissipation system. The heat dissipation structure includes thermally conductive materials that also serve as electrical connection pathways, combining two functions into a single integrated structure that reduces overall complexity despite the recessed mounting configuration.
Solution Approach 2:
The patent introduces intermediary conductive structures within the circuit substrate that facilitate electrical connection to the recessed light source. These intermediary elements, such as conductive adhesives or embedded traces, act as mediators between the light source terminals and the external circuitry, simplifying the connection process despite the recessed position.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the thickness of the illumination system, improves heat dissipation, and maintains light emission efficiency by integrating light sources into the circuit substrate, addressing the limitations of traditional direct-lighting systems.
Implementation Method 1
a plurality of light emitting diode elements mounted on the substrate
Implementation Method 2
improves heat dissipation by exposing the light source's bottom to the rear surface, allowing for improved cooling
Data Source
AI summary
An illumination system includes a light source unit including a light source and a circuit substrate electrically connected to the light source. The light source is placed in the circuit substrate such that at least part of the light source overlaps the circuit substrate in the thicknesswise direction of the circuit substrate.