Recessed Optical Package Lid-Carrier Structure for Bleed-Free Assembly
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Solution Overview
Problem
The integration of semiconductor devices into carriers for optical device packages increases manufacturing costs due to complex assembly processes and material costs, particularly when trying to maintain performance and prevent adhesive bleeding during assembly.
Innovation Solution
An optical device package design featuring a carrier with recessed surfaces and a lid disposed on the carrier, where the adhesive is applied at the recessed portion to prevent bleeding and ensure proper alignment, using optical glue with an optical density greater than 3, and formed by injection molding to unify surface roughness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If semiconductor devices are integrated or embedded into the carrier for miniaturization, then the device size is reduced, but the manufacturing cost increases
Solution Approach 1:
The patent divides the package into separate components: a carrier with recessed portions and a lid with protruding portions. The semiconductor devices are mounted on the carrier in recessed areas, while the lid covers the top. This segmentation allows for simpler, less costly manufacturing processes compared to full integration, while still achieving miniaturization through the compact recessed design.
Solution Approach 2:
The patent implements nesting by placing the semiconductor devices within recessed portions of the carrier, and then covering them with a lid that has protruding portions that fit into corresponding recesses. This nested arrangement achieves miniaturization without requiring expensive integration processes, as each component can be manufactured separately and assembled.
2Strength
If adhesive is applied to bond the lid to the carrier, then the components are securely joined, but adhesive bleeding occurs during assembly
Solution Approach 1:
The patent applies adhesive locally to specific surfaces: the lid is bonded to the carrier at the protruding portions that fit into recessed areas. This localized bonding approach confines the adhesive to precise locations, preventing bleeding while maintaining secure joints where needed.
Solution Approach 2:
The protruding portions of the lid serve as intermediaries between the lid and carrier bodies. Adhesive is applied to these protruding portions, which then engage with recessed areas in the carrier. This intermediary structure controls adhesive placement and prevents bleeding while ensuring secure bonding.
3Shape
If the lid and carrier surfaces are made coplanar, then the package has a compact profile, but wire drag occurs during assembly
Solution Approach 1:
The patent segments the bonding surfaces into coplanar top surfaces for the final package profile, while creating recessed and protruding portions at the bonding interface. This allows the outer surfaces to be coplanar for a compact appearance, while the internal recessed structure prevents wire drag during assembly by providing clearance space.
Solution Approach 2:
The patent resolves the conflict by moving the anti-drag feature to another dimension: while the top surfaces are coplanar in the vertical dimension, the bonding interface incorporates recessed portions that create horizontal clearance space. This dimensional solution prevents wire drag without compromising the compact coplanar profile.
Data Source
AI summary
An optical device package comprises a carrier having a first surface and a second surface recessed with respect to the first surface and a lid disposed on the second surface of the carrier.