Recessed Mark Formation on Metal Support Boards for Wiring Circuit Assembly
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Solution Overview
Problem
The production of wiring circuit boards faces issues with decreased yield and productivity due to resin varnish overflow when forming through holes as alignment marks, and traceability challenges when trace marks are added post-production.
Innovation Solution
A method involving the formation of recessed marks on a metal support board before the insulating layer is applied, allowing for improved traceability and yield by suppressing varnish overflow and enabling alignment of subsequent layers with the marks as references.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If through holes are formed in the metal support board to create alignment marks, then alignment accuracy is improved, but resin varnish overflows from the through holes causing decreased yield
Solution Approach 1:
The mark is formed on the metal support board before the insulating layer is applied. This preliminary action allows the mark to serve as a reference for subsequent alignment operations without interfering with the insulating layer formation process, thereby preventing resin overflow while maintaining alignment accuracy.
2Loss of information
If trace marks are added to the wiring circuit board after production, then traceability is ensured, but intermediate products cannot be controlled during production
Solution Approach 1:
The mark is formed on the metal support board at the beginning of the production process, before any insulating layers are applied. This allows the mark to serve dual purposes: as a traceability identifier for intermediate products during production, and as an alignment reference for subsequent layers, thereby improving both traceability and productivity.
3Loss of information
If marks are formed after lamination of insulating layers, then the wiring circuit board can be traced after production, but productivity cannot be improved
Solution Approach 1:
The mark is formed on the metal support board before the insulating layer is applied. This preliminary formation of the mark allows it to be used for traceability during production and as an alignment reference for subsequent layers, thereby improving productivity while maintaining traceability.
4Measurement precision
If through holes are used as alignment marks, then alignment reference is provided, but resin overflow occurs reducing manufacturing quality
Solution Approach 1:
The mark is formed on the metal support board before the insulating layer is applied. This preliminary action provides an alignment reference without creating through holes that would allow resin overflow, thereby maintaining both alignment precision and manufacturing quality.
Data Source
AI summary
A method for producing a wiring circuit board assembly sheet includes a marking step of forming a mark made of a recessed portion in a metal support board, and after the marking step, an insulating layer forming step of forming a base insulating layer on one surface in a thickness direction of the metal support board formed with the mark.