Recessed Optical Module Design for Thin Cellular Phones
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional optical modules for mobile telephones have a high profile due to the use of thick printed circuit boards as mechanical supports, which limits their thickness and integration with thinner devices.
Innovation Solution
A recessed optical module design where a metal or ceramic support plate on the lower side of the printed circuit board allows the image sensor to be lowered, reducing the module's profile, and using a multilayer printed circuit board with an opening for the image sensor, while maintaining mechanical stability and heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a thick printed circuit board is used as mechanical support, then mechanical stability is improved, but the module thickness increases
Solution Approach 1:
The printed circuit board is divided into two functional parts: a thin signal processing layer and a separate mechanical support plate. The support plate is made from metal or ceramic material and is positioned at the lower side of the printed circuit board, providing mechanical stability without increasing the overall module thickness. This segmentation allows the optical module to achieve a thinner profile while maintaining structural integrity.
Solution Approach 2:
A support plate acts as an intermediary element between the printed circuit board and the image sensor. This support plate provides the necessary mechanical support and heat transfer functionality, allowing the printed circuit board to be made thinner while still maintaining structural stability. The support plate mediates between the conflicting requirements of thin profile and mechanical strength.
2Length of stationary object
If the image sensor is lowered using a support plate, then module thickness is reduced, but manufacturing complexity increases
Solution Approach 1:
The support plate is integrated with the printed circuit board assembly, combining the mechanical support function with the electrical circuit function into a unified structure. This merging simplifies the manufacturing process by reducing the number of separate components that need to be assembled, while still achieving the thinner profile through the optimized layered structure.
3Length of stationary object
If a thin printed circuit board is used, then module thickness is reduced, but heat transfer capability deteriorates
Solution Approach 1:
The optical module uses a composite structure combining thin printed circuit board material with metal or ceramic support plate material. This composite construction allows the module to achieve a thin profile while the metal or ceramic support plate provides excellent heat transfer capability, compensating for the limited thermal mass of the thin circuit board.
Data Source
AI summary
The invention relates to an optical module for a cellular phone having an image sensor comprising a light sensitive upper side for detecting and converting optical signals into electrical signals, an imaging device for imaging the optical signals on the image sensor, and a circuit board comprising an upper side and a lower side electrically and mechanically connected to the image sensor. In order to create a particularly flat optical module, for example for integration into a cellular phone, the invention provides that the circuit board has a recess in which the image sensor is disposed such that a lower side of the image sensor is substantially located at the same height as the lower side of the circuit board.