Recessed Package Structure for Dense Sensor Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The semiconductor industry faces challenges in reducing the size of electronic components and packaging to accommodate increased integration density, requiring smaller packages that utilize less area while maintaining efficient electrical connectivity and sensor integration in wearable devices.
Innovation Solution
A package structure and method involving a carrier substrate with a release layer, dielectric and metallization layers, and redistribution structures for forming integrated circuit dies, which are then encapsulated and singulated to be embedded within a recessed substrate for enhanced sensor integration and area efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If traditional packaging structures are used, then electrical connectivity is maintained, but the package area is too large for wearable devices requiring high integration density
Solution Approach 1:
The patent transitions from planar packaging to three-dimensional packaging by forming a recess in the substrate and embedding the package within it. This vertical dimensionality change allows the package to occupy less surface area while maintaining all necessary electrical connections through the substrate thickness, directly resolving the contradiction between reduced package area and maintained electrical connectivity.
Solution Approach 2:
The package structure is nested within the substrate recess, with the package containing the die, encapsulant, and redistribution layers embedded inside the substrate cavity. This nesting arrangement allows the package to be housed within the substrate volume rather than requiring additional surface area, achieving high integration density while preserving all electrical pathways.
2Area of moving object
If package size is reduced for wearability, then area efficiency improves, but sensor integration capability is limited
Solution Approach 1:
By utilizing the vertical dimension through substrate recess embedding, the patent creates additional space for sensor integration within the package volume. Sensors can be positioned on different layers and orientations within the three-dimensional package structure, enabling versatile sensor integration without increasing the footprint area, thus resolving the contradiction between area efficiency and sensor integration capability.
3Productivity
If integration density is increased, then component count per area improves, but manufacturing complexity increases
Solution Approach 1:
The substrate recess is formed beforehand before package assembly, and the package structure is designed with predetermined redistribution layers and connection points. This preliminary preparation of the substrate cavity and package architecture simplifies the subsequent assembly process, allowing high integration density to be achieved without proportionally increasing manufacturing complexity, as the complex three-dimensional arrangement is established during design rather than assembly.
Data Source
AI summary
Package structures and methods of forming package structures are described. A method includes placing a first package within a recess of a first substrate. The first package includes a first die. The method further includes attaching a first sensor to the first package and the first substrate. The first sensor is electrically coupled to the first package and the first substrate.