Recessed Semiconductor Package Layout for Flexible I/O Bonding
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Solution Overview
Problem
The semiconductor industry faces challenges in creating reliable bonding structures for advanced semiconductor package devices due to reduced dimensions and increased density, which limits the available bonding area and flexibility in connector layout, affecting electrical connectability.
Innovation Solution
A semiconductor structure is proposed with a recessed substrate that accommodates one semiconductor die and a second substrate bonded to both sides, along with conductive pads and traces, and a molding material encapsulating the structure, allowing for increased bonding area and flexible connector placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the device footprint is reduced to increase device density, then the device size is reduced, but the bonding area becomes limited
Solution Approach 1:
The patent introduces a second substrate bonded to the first substrate, creating a three-dimensional stacked configuration. This vertical arrangement allows bonding connectors to be distributed across multiple layers and surfaces, effectively increasing the total bonding area without expanding the device footprint. The first semiconductor die is bonded to the first substrate, while the second substrate provides additional bonding surfaces, utilizing the third dimension to resolve the contradiction between compact size and sufficient bonding area.
2Adaptability or versatility
If the number of input/output terminals is increased, then the device functionality is enhanced, but the bonding area becomes insufficient
Solution Approach 1:
By bonding the second substrate to the first substrate, the patent creates additional bonding surfaces in the vertical dimension. This allows the increased number of input/output terminals to be distributed across multiple bonding interfaces, including the first substrate's bonding surface and the second substrate's bonding surface, thereby accommodating more terminals without requiring a proportional increase in the planar bonding area.
Solution Approach 2:
The patent divides the bonding functionality across multiple substrates and surfaces. The first substrate provides one bonding interface, while the second substrate provides additional bonding interfaces. This segmentation of the bonding structure allows the total bonding capacity to be distributed across multiple locations, enabling support for more input/output terminals within the same footprint.
3Volume of moving object
If the device footprint is reduced, then the device density is increased, but the flexibility in connector layout is reduced
Solution Approach 1:
The patent utilizes the vertical dimension by introducing a second substrate bonded to the first substrate. This three-dimensional configuration provides multiple bonding surfaces and interfaces, enabling flexible connector layout arrangements that can accommodate various design requirements. Connectors can be strategically placed on different surfaces and layers, offering layout flexibility despite the reduced device footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances bonding performance by increasing the bonding area and flexibility in connector layout, ensuring reliable electrical connectivity and compliance with design specifications.
Implementation Method 1
a first semiconductor die arranged in the recess and bonded to the first side of the first substrate; a second semiconductor die bonded to the second side of the first substrate
Implementation Method 2
a second substrate electrically bonded to the first side of the first substrate
Implementation Method 3
a first conductive pad arranged on a first side of the first semiconductor die facing the first side of the first substrate, wherein the first conductive pad is electrically bonded to the first side of the first substrate
Data Source
AI summary
The present disclosure provides a semiconductor package structure and a method of manufacturing a semiconductor package structure. The semiconductor package structure includes a first substrate having a first side and a second side opposite to the first side, wherein the first side includes a recess recessed from the first side, a first semiconductor die arranged in the recess bonded to the first side of the first substrate; a second semiconductor die bonded to the second side of the first substrate; and a second substrate electrically bonded to the first side of the first substrate.