Recessed Sensor Carrier Structure for Reduced-Height Camera Modules
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Solution Overview
Problem
The existing image-capturing modules in portable electronic devices face challenges in reducing height without altering the optical length TTL, which affects the module's thickness, and current solutions like the Flip-Chip process are costly and not economically viable at lower production scales.
Innovation Solution
A reduced-height image-capturing module design featuring a lens assembly, image-sensing chip, and a carrier base with a circuit substrate having a through opening, where the carrier base's extending plate bodies cross over the substrate and the image-sensing chip is placed on a recessed surface, allowing the module to achieve a similar height reduction to Flip-Chip configurations without changing the TTL.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If COB process is used to place image-sensing chip on upper surface of circuit substrate, then manufacturing cost is reduced, but module height increases significantly
Solution Approach 1:
The patent transitions from placing the image-sensing chip on the upper surface (2D plane) to placing it on the lower surface of the circuit substrate (opposite side). This dimensional change allows the lens assembly and image-sensing chip to be positioned on opposite sides of the substrate, effectively reducing the vertical stacking height while maintaining the COB process cost advantage.
2Length of stationary object
If Flip-Chip process is used to place image-sensing chip on lower surface, then module height is reduced, but manufacturing and maintenance cost increases significantly
Solution Approach 1:
The patent creates a modified version of the Flip-Chip approach by using COB process with through-opening technology. Instead of directly implementing the expensive Flip-Chip method, it copies the beneficial height-reduction effect through an alternative structural design that uses standard COB process, thereby achieving similar compactness without the high manufacturing costs.
3Manufacturing precision
If traditional lens assembly structure is used, then TTL is maintained, but module height increases
Solution Approach 1:
The patent inverts the traditional arrangement by placing the image-sensing chip on the lower surface of the circuit substrate instead of the upper surface. This inversion allows the optical path to be established through the substrate thickness, maintaining TTL precision while significantly reducing the overall module height as the lens assembly and sensor are now positioned on opposite sides with minimal vertical separation.
Data Source
AI summary
The present invention provides a reduced-height image-capturing module, which includes a lens assembly, an image-sensing chip, a carrier base and a circuit substrate. The carrier base has a base body, two extending plate bodies extending and a base groove recessed. A lower portion of the base body enters a through opening of the circuit substrate, and the two extending plate bodies cross over the through opening of the circuit substrate and are disposed on an upper surface of the circuit substrate. The image-sensing chip is disposed on a recessed bottom surface of the base groove which is not at the same level as the upper surface of the circuit substrate, so that the recessed bottom surface is lower than the upper surface of the circuit substrate. The lens assembly is disposed on the upper portion of the base body and corresponds to the image-sensing chip.