Recessed Substrate Structuring With Localized Alumina Hydrate Etching

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Solution Overview

Problem

Existing methods for forming nano-order fine recessed and projected structures on substrate surfaces do not effectively create such structures only on the bottom surface of recessed portions, and often result in similar structures forming on other surfaces of the substrate.

Innovation Solution

A structure manufacturing method involving mask formation, first etching to create recessed portions, thin film formation with aluminum on the recessed portion bottoms, hot water treatment to form a fine recessed and projected alumina hydrate layer, second etching to create the fine structure on the bottom surface, and finally mask removal.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional etching methods are used to form fine recessed and projected structures, then nano-order fine structures can be formed on the substrate surface, but the structures are formed on the entire surface including areas outside the recessed portions

Engineering Contradiction:
Improveprecision of fine structure locationVSAvoidunwanted fine structures on non-recessed areas
Core Design Contradiction:
Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

The method performs preliminary actions by forming the recessed portions first, then forming the aluminum-containing thin film only on the bottom surfaces of these pre-formed recessed portions. This preliminary positioning ensures that subsequent hot water treatment and etching only affect the intended areas, preventing unwanted fine structures from forming on the entire substrate surface.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The invention applies local quality by making the aluminum-containing thin film appear only on specific locations (bottom surfaces of recessed portions) rather than uniformly across the entire substrate. This localized material distribution ensures that the fine recessed and projected structures are generated only where needed, achieving precise spatial control.

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If multiple lithography and etching steps are repeated to form complex structures, then fine recessed and projected structures can be formed, but the manufacturing process becomes complex and time-consuming

Engineering Contradiction:
Improvecomplexity of structure formationVSAvoidnumber of process steps
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The invention utilizes phase transition by treating the aluminum-containing thin film with hot water, which transforms the film into a fine recessed and projected layer through hydrolysis and phase change. This single phase transition step replaces multiple conventional lithography and etching steps, simplifying the manufacturing process while achieving the desired complex structure.

Inventive Principle:
Principle #36Phase transitions

Solution Approach 2:

The aluminum-containing thin film serves as an intermediary material that enables the formation of fine structures through hot water treatment. This intermediary layer acts as a precursor that transforms into the final fine recessed and projected structure, eliminating the need for repeated lithography and etching steps required in conventional methods.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Area of stationary object

If the fine recessed and projected structure is formed on the entire substrate surface, then complete coverage is achieved, but the structure cannot be selectively formed only on the bottom surface of recessed portions

Engineering Contradiction:
Improvecoverage area of fine structureVSAvoidselectivity of fine structure location
Core Design Contradiction:
Area of stationary objectVSManufacturing precision

Solution Approach 1:

The invention applies local quality by making the aluminum-containing thin film appear only on specific locations (bottom surfaces of recessed portions) rather than uniformly across the entire substrate. This localized material distribution ensures that the fine recessed and projected structures are generated only where needed, achieving precise spatial control.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The method performs preliminary actions by forming the recessed portions first, then forming the aluminum-containing thin film only on the bottom surfaces of these pre-formed recessed portions. This preliminary positioning ensures that subsequent hot water treatment and etching only affect the intended areas, preventing unwanted fine structures from forming on the entire substrate surface.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables the formation of a relatively small fine recessed and projected structure only on the bottom surface of a larger recessed portion on the substrate, achieving the desired surface topology with high precision.

Implementation Method 1

treating the thin film including aluminum with hot water to change the thin film into a fine recessed and projected layer including alumina hydrate

Methodology Applied
Scientific EffectHydrolysis: Hydrolysis

Implementation Method 2

change the thin film into a fine recessed and projected layer including alumina hydrate

Methodology Applied
Scientific EffectPhase change: Phase Change

Data Source

PatentUS12293920B2Structure manufacturing method
Publication Date: 2025.05.06 FUJIFILM CORP
  • US12293920B2 patent drawing
  • US12293920B2 patent drawing
  • US12293920B2 patent drawing

AI summary

A structure is manufactured by forming a mask that has an opening pattern on a surface of a substrate, etching the surface of the substrate with the mask to form a recessed portion corresponding to the opening pattern of the mask, forming a thin film including aluminum on a bottom surface of the recessed portion in a state where the mask remains, treating the thin film including aluminum with hot water to change the thin film into a fine recessed and projected layer including alumina hydrate smaller than the recessed portion, etching the bottom surface of the recessed portion, on which the fine recessed and projected layer is formed, in a state where the mask remains to form a fine recessed and projected structure on the bottom surface of the recessed portion, and thereafter removing the mask and the fine recessed and projected structure, which remains after the etching step.