Component Module With Recessed Substrate For Density
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Solution Overview
Problem
The existing component-containing modules with electronic components mounted on both surfaces of a core substrate and embedded in resin face challenges in reducing size due to increased thickness from a higher number of interconnection layers and passive elements, limiting the compactness and density of component arrangement.
Innovation Solution
A component-containing module design featuring a core substrate with recessed portions and a raised portion, where integrated circuit elements are mounted above the raised portion, and passive elements are placed in recessed portions, covered by a resin layer with via-hole conductors and a shielding layer, allowing for dense component arrangement and reduced profile.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of interconnection layers is increased to accommodate more terminals and passive elements, then the functional capability and component density are improved, but the thickness of the core substrate increases, preventing the module size from being reduced
Solution Approach 1:
The invention transitions from a planar arrangement of components to a three-dimensional arrangement by forming recessed portions in the core substrate. Passive elements are embedded within these recessed portions, utilizing the vertical dimension (depth) rather than only the horizontal plane. This allows multiple components to be arranged in different depth levels, increasing component density without proportionally increasing the overall module thickness, as the recessed portions are integrated within the substrate volume.
Solution Approach 2:
The invention embeds passive elements within recessed portions of the core substrate, creating a nested structure where components are housed within the substrate volume rather than being mounted only on its surfaces. The resin layer further encapsulates these embedded elements, creating multiple nested layers (substrate → recessed portion → passive element → resin encapsulation). This nesting approach maximizes space utilization and increases component density while maintaining a compact overall form factor.
2Quantity of substance
If electronic components are densely arranged on the core substrate, then the component density is improved, but the mechanical strength and structural integrity may be compromised
Solution Approach 1:
The invention introduces recessed portions with specific geometric characteristics (depth, width, shape) tailored to the requirements of different passive elements. Each recessed portion is locally optimized to provide mechanical support and proper positioning for its embedded component. The resin layer is also applied with local quality considerations, providing encapsulation and mechanical protection specifically where components are embedded, thereby maintaining structural integrity while enabling dense arrangement.
3Shape
If passive elements are embedded in resin to provide a flat mounting surface, then the surface flatness and component protection are improved, but the heat dissipation efficiency may be reduced due to resin being a thermal insulator
Solution Approach 1:
The invention segments the resin layer into different functional zones: a first resin layer that provides thermal management by直接接触 (direct contact) with heat-generating components, and a second resin layer that provides electrical insulation and environmental protection. This segmentation allows the resin structure to simultaneously achieve surface flatness, component protection, and improved heat dissipation through the thermally conductive first resin layer.
Data Source
AI summary
A component-containing module includes a core substrate which includes a lower surface including recessed portions and a raised portion, and an upper surface facing the lower surface and which includes a plurality of in-plane conductors, an integrated circuit element arranged at a location which is above the upper surface and which corresponds to the raised portion, a first passive element and a second passive element disposed in the recessed portions of the lower surface, a composite resin layer which underlies the lower surface and which has a flat or substantially flat surface, and an external terminal electrode which is disposed on the flat or substantially flat surface of the composite resin layer and which is electrically connected to the in-plane conductors of the core substrate. The component-containing module enables electronic components, such as integrated circuit elements and passive elements, to be densely arranged and to be reduced in profile and size.