Recessed Surface-Mount Connector for Thin Electronic Modules
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Solution Overview
Problem
Conventional surface mount technology for electronic devices increases the thickness of the device due to the mounting of connectors, which is not suitable for reducing the size and thickness of electronic devices.
Innovation Solution
An electronic circuit module design featuring a substrate with a recessed portion and a connector mounted such that the terminals protrude and contact a conductive pattern, with a stepped portion engaging the substrate to reduce thickness and enhance stability, and reinforcing features to prevent distortion and warping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a connector is mounted on the substrate using conventional surface mount technology, then the connector can be connected to the substrate surface, but the thickness of the electronic device increases due to the entire thickness of the connector being added
Solution Approach 1:
The connector body is nested into a recessed portion formed in the substrate, allowing the connector to be partially embedded rather than sitting entirely on the substrate surface. This nesting approach reduces the overall thickness of the electronic device while maintaining reliable electrical connections through the protruding terminals that contact conductive patterns on the substrate surface.
Solution Approach 2:
The substrate is designed with a recessed portion at the specific location where the connector is mounted, creating a local structural modification. This local quality change allows the connector body to be positioned lower than the substrate surface, reducing thickness, while the protruding terminals maintain contact with conductive patterns to ensure reliable electrical connection.
2Length of stationary object
If the connector body is positioned lower than the substrate surface to reduce thickness, then the electronic device thickness is reduced, but the connector stability and strength may be compromised
Solution Approach 1:
The recessed portion is pre-formed in the substrate before the connector is mounted, creating a prepared structural feature that guides and supports the connector body. This preliminary structural preparation ensures that when the connector is installed, its body is properly positioned and supported within the recess, maintaining strength and stability while achieving thickness reduction.
Solution Approach 2:
The connector body is nested within the recessed portion of the substrate, which provides structural support and anchoring. This nesting arrangement distributes the mechanical loads and maintains connector strength, as the recessed portion acts as a structural cradle that prevents the connector body from being overly stressed despite being positioned lower than the substrate surface.
3Reliability
If the connector is mounted with protruding terminals to contact conductive patterns, then electrical connection is achieved, but the connector structure becomes more complex
Solution Approach 1:
The protruding terminals serve multiple functions: they provide electrical connection by contacting conductive patterns on the substrate surface, they extend from the recessed portion to establish reliable electrical contact, and they maintain a standardized connection interface. This multi-functionality approach achieves reliable electrical connection without requiring additional complex components or structures.
Data Source
AI summary
A first recessed portion shaped so as to be open toward an outer periphery of a substrate is disposed on the substrate, and a conductive pattern is provided on an edge portion of the first recessed portion. A connector mounted on the substrate includes a body and terminals which are surface-mounted on the substrate and protrude from the body. The connector is mounted on the substrate such that a bottom of the terminals is positioned higher than a bottom of the body by a predetermined height. The connector is mounted on the substrate such that the body is disposed in the first recessed portion and the terminals contact the conductive pattern on the substrate.