Recessed Susceptor Angled Support Elements Substrate Stability
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Solution Overview
Problem
Conventional susceptor designs in semiconductor processing lead to process non-uniformity and substrate slipping issues due to inadequate support and thermal gradient issues.
Innovation Solution
The use of a susceptor plate with a recess and angled support elements, each sloped toward the center, reduces contact area and prevents slipping, while lift pin holes allow for precise substrate positioning and movement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional susceptor designs are used, then substrate support is provided, but process non-uniformity and substrate slipping occur
Solution Approach 1:
The susceptor plate features a recessed region with angled support elements that create localized contact points rather than uniform contact across the entire substrate periphery. This local quality change concentrates support at specific locations while reducing overall contact area, preventing substrate slipping and improving process uniformity by eliminating thermal gradients at the substrate-susceptor interface
Solution Approach 2:
The continuous peripheral contact between substrate and susceptor is segmented into discrete contact regions defined by the recessed area and angled support elements. This segmentation reduces the total contact area to specific zones, preventing substrate slipping while improving process uniformity by minimizing thermal interference at the interface
2Strength
If conventional susceptor designs with full peripheral contact are used, then substrate support is provided, but thermal gradients cause process non-uniformity
Solution Approach 1:
The recessed region with angled support elements creates localized contact points that reduce thermal mass at the substrate-susceptor interface. This local quality change minimizes thermal gradients by reducing the area through which heat is transferred, thereby improving process uniformity while maintaining adequate substrate support through strategic contact point placement
3Reliability
If substrate contact area with susceptor is increased, then substrate stability improves, but process non-uniformity worsens due to thermal effects
Solution Approach 1:
The contact area is segmented into discrete regions through the recessed design with angled support elements, concentrating support function at specific locations rather than distributing it uniformly. This segmentation maintains substrate stability through adequate contact points while reducing overall contact area to minimize thermal effects and improve process uniformity
Solution Approach 2:
The susceptor plate incorporates a recessed region that changes the vertical dimension of the contact interface. By creating a recess rather than a flat contact surface, the design reduces the effective contact area in the horizontal plane while maintaining support functionality, thereby improving process uniformity without sacrificing substrate stability
Data Source
AI summary
Apparatus for supporting a substrate are provided herein. In some embodiments, a substrate support includes a susceptor plate having a top surface; a recess formed within the top surface, wherein the recess is defined by an edge; and a plurality of angled support elements disposed within the recess and along the edge of the recess, wherein each angled support element comprises a first surface downwardly sloped toward a center of the recess.