Recessed Wire-Bond Package Structure to Prevent Solder Bridging
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Solution Overview
Problem
Current package structures face issues with solder bridging between conductive terminals due to the use of soldering materials, which can lead to undesired connections and yield reduction, especially with pitches as small as 20-30 μm.
Innovation Solution
The package structure incorporates a wiring structure with recesses and conductive wires that connect conductive elements without soldering, reducing the inclination of elements and eliminating the need for soldering materials, thereby preventing bridging issues and enhancing manufacturing flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If soldering materials are used to bond conductive terminals, then bonding strength is improved, but bridging between conductive terminals occurs causing yield reduction
Solution Approach 1:
The patent extracts and removes the soldering material from the bonding process, replacing it with a wire-based connection system. The wire is directly bonded to the conductive terminals without using solder, thereby eliminating the source of bridging issues while maintaining electrical connectivity and mechanical support.
Solution Approach 2:
The patent introduces a wire as an intermediary element between the conductive terminals. This wire serves as a mediator that provides both electrical connection and mechanical support without requiring soldering materials, thus preventing bridging between adjacent terminals while maintaining bonding strength.
2Length of moving object
If pitch between conductive terminals is decreased for miniaturization, then package size is reduced, but bridging risk increases
Solution Approach 1:
By removing the soldering material entirely and using direct wire bonding, the patent eliminates the bridging risk that would otherwise increase with smaller pitches. The wire-based system allows for precise placement and controlled connection without the spreading and bridging issues associated with reflowed solder.
3Ease of manufacture
If soldering materials are used, then bonding process is simplified, but manufacturing flexibility is reduced due to reflow requirements
Solution Approach 1:
The patent replaces the thermal-based soldering process with a mechanical wire bonding process. This substitution eliminates the need for reflow heating, allowing for greater manufacturing flexibility and adaptability in the assembly process while maintaining bonding effectiveness.
Data Source
AI summary
A package structure is provided. The package structure includes a wiring structure, a first element, and a plurality of first wires. The wiring structure has a first recess recessed from a first surface of the wiring structure. The first element is disposed over the first surface of the wiring structure. The first wires are disposed in the first recess and extending in a direction from the wiring structure to the first element. The first wires are configured to reduce an inclination of the first element with respect to the first surface of the wiring structure.