Variable Loop Recipe Offsets for Uniform Layer Thickness

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Solution Overview

Problem

Conventional substrate processing methods require multiple separate recipes to maintain uniform layer thickness, leading to increased energy consumption, processor overhead, and damage to substrates and processing systems, due to the need for repeated adjustments of manufacturing parameters across multiple iterations.

Innovation Solution

A variable loop control feature that uses a single recipe with iteration adjustments and multipliers to achieve uniform layer thickness, reducing the need for multiple separate recipes by generating an offset table to adjust manufacturing parameters across iterations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If multiple separate recipes are used to maintain uniform layer thickness, then layer uniformity is improved, but energy consumption increases

Engineering Contradiction:
Improvelayer uniformityVSAvoidenergy consumption
Core Design Contradiction:
Manufacturing precisionVSUse of energy by moving object

Solution Approach 1:

The patent combines multiple separate recipes into a single unified recipe that incorporates iterative processing capabilities. The system performs multiple iterations of the same recipe with automatic parameter adjustments, eliminating the need to load and execute multiple separate recipes while maintaining layer uniformity through in-process adjustments.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent introduces dynamic parameter adjustment within a single recipe execution. The system automatically modifies manufacturing parameters during iterative processing based on real-time measurements, allowing the recipe to adapt and maintain uniformity without requiring multiple static recipes.

Inventive Principle:
Principle #15Dynamics

2Manufacturing precision

If multiple separate recipes are used to maintain uniform layer thickness, then layer uniformity is improved, but processor overhead increases

Engineering Contradiction:
Improvelayer uniformityVSAvoidprocessor overhead
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent merges multiple recipe management functions into a single iterative processing framework. The system loads one recipe and performs repeated executions with automatic adjustments, reducing the computational burden of loading, validating, and managing multiple separate recipes while achieving the same uniformity goals.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The system implements self-service through automatic parameter adjustment within the iterative loop. The processing system autonomously modifies parameters based on measurements without requiring external intervention or complex coordination between multiple recipes, reducing processor overhead for recipe management.

Inventive Principle:
Principle #25Self-service

3Manufacturing precision

If multiple separate recipes are used to maintain uniform layer thickness, then layer uniformity is improved, but substrate damage increases

Engineering Contradiction:
Improvelayer uniformityVSAvoidsubstrate damage
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The patent implements continuous iterative processing within a single recipe execution. The system performs sequential iterations without interrupting the processing flow, maintaining continuous substrate engagement and reducing the mechanical stress and handling damage that would occur with multiple separate recipe executions and substrate repositioning events.

Inventive Principle:
Principle #20Continuity of useful action

4Manufacturing precision

If multiple separate recipes are used to maintain uniform layer thickness, then layer uniformity is improved, but bandwidth usage increases

Engineering Contradiction:
Improvelayer uniformityVSAvoidbandwidth usage
Core Design Contradiction:
Manufacturing precisionVSLoss of energy

Solution Approach 1:

The patent consolidates data transmission and parameter management into a single iterative processing session. The system transmits measurements and adjustments within the same processing context, reducing the bandwidth overhead associated with loading and managing multiple separate recipes and their associated parameter sets.

Inventive Principle:
Principle #5Merging (Combining)

5Manufacturing precision

If multiple separate recipes are used to maintain uniform layer thickness, then layer uniformity is improved, but personnel time increases

Engineering Contradiction:
Improvelayer uniformityVSAvoidpersonnel time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The system performs automatic parameter adjustment and iterative optimization without requiring personnel intervention to switch between multiple recipes. The single recipe with iterative capabilities self-adjusts parameters based on real-time measurements, eliminating the time personnel would spend managing multiple separate recipes and reducing operational complexity.

Inventive Principle:
Principle #25Self-service

Data Source

PatentUS11449026B2Variable loop control feature
Publication Date: 2022.09.20 APPLIED MATERIALS INC
  • US11449026B2 patent drawing
  • US11449026B2 patent drawing
  • US11449026B2 patent drawing

AI summary

A method includes identifying a recipe for depositing a plurality of layers on a substrate in a processing chamber of a substrate processing system. The recipe includes iterations of a set of processes. Each iteration is for depositing at least one layer. The method further includes determining iteration adjustments to cause uniformity of the layers. Each iteration adjustment corresponds to a respective iteration. The method further includes determining multipliers to cause an adjustment in thickness of one or more layers of the layers. Each multiplier of the multipliers corresponds to a corresponding iteration. The method further includes storing the iteration adjustments and the multipliers as stored iteration adjustments and stored multipliers. The layers are deposited on substrates based on the recipe and the stored iteration adjustments and the stored multipliers.