Reclaimable Semiconductor Package With Die Module Disablement
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Solution Overview
Problem
Semiconductor device packages often suffer from inoperable or underperforming dies due to thermal and mechanical stresses during assembly, leading to reduced packaging density and increased likelihood of failure as the number of dies increases.
Innovation Solution
The implementation of a semiconductor device package with a configuration component that stores a module configuration state, allowing for the identification and disablement of inoperable dies, and a logic component that activates or deactivates dies based on a reclamation state, enabling the package to operate with remaining functional dies without the need for extensive jumper connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of semiconductor dies in a package is increased to increase packaging density, then packaging density is improved, but the likelihood of having damaged or inoperable dies increases
Solution Approach 1:
The patent divides the semiconductor package into multiple independent modules, where each module contains one or more dies. This segmentation allows individual modules to be disabled independently through configuration components, so that if some dies are damaged, the functional modules can continue to operate. The package is effectively segmented into reclaimable and non-reclaimable portions based on die functionality.
Solution Approach 2:
The patent changes the operational state parameter of individual dies or modules from active to inactive through configuration components. By modifying the operational parameter (enabled/disabled state) rather than the physical structure, the system can adapt to die failures and maintain functionality. This parameter change allows the package to dynamically adjust its operational capacity based on die health.
2Quantity of substance
If conventional packaging techniques are used to increase packaging density, then packaging density is improved, but manufacturing complexity increases due to the need for extensive jumper connections
Solution Approach 1:
The patent extracts the complexity of manual jumper connections by introducing integrated configuration components directly within the package. These configuration components replace the need for external jumper wires and manual connections, taking out the complex manufacturing step and embedding the functionality directly into the package structure. This extraction simplifies the manufacturing process while maintaining the ability to selectively enable/disable dies.
Solution Approach 2:
The configuration components act as intermediaries between the dies and the external environment, managing the enable/disable states without requiring direct external intervention through jumpers. This intermediary mechanism automates what would otherwise require manual manipulation, reducing manufacturing complexity while preserving the reclamation functionality.
3Quantity of substance
If thermal and mechanical stresses are applied during the assembly process, then packaging density is improved through compact assembly, but die integrity deteriorates causing damage or disconnection
Solution Approach 1:
The patent implements a compensation mechanism through configuration components that are programmed in advance to account for potential die failures. This beforehand cushioning allows the system to tolerate die damage by having pre-configured alternatives ready to be activated. The configuration components store redundancy information that cushions against the impact of die failure during or after the stressful assembly process.
Solution Approach 2:
The patent enables the discarding of damaged dies through the configuration components, which can selectively disable inoperable dies. The functional capacity is then recovered by activating remaining good dies or alternative modules. This discarding and recovering process allows the package to maintain functionality despite die damage incurred during compact assembly, effectively separating the damaged portions from the functional portions.
Data Source
AI summary
Several embodiments of reclaimable semiconductor device packages and assemblies are disclosed herein. A semiconductor device assembly (100) includes a package (101) having a housing (102) and a package contact (104) arranged to receive a signal indicative of a reclamation state. A plurality of modules of semiconductor dies (106) are located within the housing and electrically coupled to the package contact (104). The dies (106) of the first and second modules dies are configured to store a module configuration state. The first and second modules (107a, 107b) are enabled for operation based, at least in part, on the reclamation state and the module configuration state.