Reclosable Closure System With Buffer Zone For Flexible Packaging
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Solution Overview
Problem
Traditional flexible package closures, such as molded rigid plastic assemblies and flexible plastic lid-like flaps, face issues with maintaining a seal, losing adhesion after multiple open-close cycles, and struggling to remove the perforated section without user intervention due to adhesive distribution.
Innovation Solution
A reusable closure system featuring a base and lid with touch fastener fields separated by a multi-layer buffer zone, where the buffer zone is substantially free of active adhesive, and the touch fastener fields provide localized peel strength to facilitate easy removal of the frangible region, ensuring a secure seal and easy access to the product.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive is distributed across the entire closure base to maintain seal, then sealing reliability is improved, but the frangible region cannot be easily removed without user intervention
Solution Approach 1:
The adhesive distribution is made non-uniform: the buffer zone has reduced or no adhesive to enable easy frangible region removal, while the seal zones (perimeter and central areas) have full adhesive coverage to maintain sealing reliability. This local differentiation resolves the contradiction between reliable sealing and easy removal.
2Strength
If rigid plastic closure assembly is used, then structural strength is improved, but flexibility and adaptability to different packaging formats is reduced
Solution Approach 1:
The invention merges the rigidity of a molded plastic closure assembly with the flexibility of a flow-wrapped bag structure. The closure base is adhered to the flexible bag, combining the strength benefits of rigid plastic with the adaptability of flexible packaging formats.
3Strength
If buffer zone contains active adhesive, then bond strength between closure and package is improved, but frangible region removal becomes difficult
Solution Approach 1:
The adhesive property is locally modified in the buffer zone to have reduced or no adhesive activity, enabling easy frangible region removal. Meanwhile, other zones maintain full adhesive strength for secure bonding. This local differentiation resolves the contradiction between bond strength and ease of removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The closure system maintains a secure seal, prevents product drying out, and allows for easy and automatic removal of the sacrificial area without user intervention, enhancing the usability and effectiveness of the packaging.
Implementation Method 1
the touch fastener fields provide localized peel strength to facilitate easy removal of the frangible region
Implementation Method 2
An edge of the lid portion is bonded (e.g., adhesive or weld) to at least one of the underlying package material and the base portion in a hinge-like fashion, and includes another touch fastener field (or many such fields)
Data Source
Figure 1a~1a'
Figure 1b~1c
Figure 1d~1g
AI summary
A reusable closure system is disclosed for flexible packaging applications. The system generally includes base and lid portions. The base portion (109) can be bonded to underlying package material and includes first and second fields of touch fasteners (111) separated by a multi-layer buffer zone (113). The buffer zone can be at least in part co-located with a frangible region of underlying package material. In some embodiments, the buffer zone is substantially free of active bonding agent, such that there is little or no active bonding agent overlapping the frangible region. One of the touch fastener fields of the base can be deployed at least partially within the area defined by the frangible region (102). The other touch fastener field is deployed around the buffer zone. The lid portion can be bonded to the package material and/or base portion, and includes a hinge and another touch fastener field to mate with the base fields.