Recognition Apparatus Imaging Magnification Adjustment for Solder Bump Alignment
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Solution Overview
Problem
Existing recognition apparatuses face accuracy issues in position recognition of semiconductor chips due to non-conformity between the arrangement of solder bumps and image sampling, leading to decreased recognition precision when the arrangement of solder bumps does not align with the imaging pixel layout.
Innovation Solution
The apparatus includes an imaging magnification adjustment unit that adjusts the imaging magnification based on the length of imaging pixels and stored shape information, ensuring that the arrangement interval of recognizable features does not conform to an integer multiple of the pixel length, thereby improving recognition accuracy by preventing alignment between the object's features and image sampling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the arrangement of solder bumps conforms to image sampling, then the imaging process is simpler, but the position recognition accuracy decreases
Solution Approach 1:
The patent changes the imaging magnification parameter to adjust the relationship between pixel size and solder bump pitch. By setting the imaging magnification such that the pixel size does not conform to an integer multiple of the solder bump pitch, the system achieves better position recognition accuracy while maintaining imaging process simplicity
Solution Approach 2:
Instead of adjusting the solder bump arrangement to match the image sampling grid, the patent inverts the approach by adjusting the imaging magnification to create a non-conforming relationship. This inversion allows the system to avoid the accuracy degradation that occurs when features align with the sampling grid
2Adaptability or versatility
If the connection portion size decreases, then the semiconductor chip design flexibility increases, but the number of pixels allocated per solder bump decreases
Solution Approach 1:
The patent changes the imaging magnification parameter to compensate for the smaller connection portion size. By adjusting the magnification, the system ensures that each solder bump is imaged with sufficient pixel resolution, maintaining position recognition accuracy even when the solder bump pitch is reduced for more flexible chip designs
3Device complexity
If the number of imaging pixels is kept constant, then the device complexity is reduced, but the position recognition accuracy decreases when solder bump pitch decreases
Solution Approach 1:
The patent changes the imaging magnification parameter to maintain position recognition accuracy without increasing the number of imaging pixels. By adjusting the magnification, the system ensures that smaller solder bumps are imaged with adequate pixel coverage, achieving high precision with the existing sensor resolution
Data Source
AI summary
The recognition and mounting apparatus including a zoom lens capable of changing imaging magnification, a chip camera, having a plurality of imaging pixels, capable of capturing an image an IC chip having a plurality of bumps arranged at at least one interval, through the zoom lens, a storage unit for storing shape information of the IC chip including at least information indicating an arrangement interval between the plurality of bumps, and a signal processor adjusting imaging magnification of the zoom lens based on a length of the imaging pixel and the information indicating the arrangement interval stored in the storage unit, and recognizing a position of the bump based on a plurality of pixel values in the image captured by the chip camera may be provided.