Recognition Device Using Multi-Condition Imaging for Lead Position Accuracy
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Solution Overview
Problem
Current recognition technologies for electrode positions on components have limitations in accurately identifying electrode positions, particularly when imaging conditions vary, leading to potential misidentification of lead tips as damaged.
Innovation Solution
A recognition device and method that employs multiple light sources and imaging conditions, including side illumination, incident illumination, and laser illumination, to create and analyze image data, allowing for recognition processing under different conditions to ensure accurate electrode position detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a single imaging condition is used for electrode position recognition, then the recognition process is simple and fast, but the recognition accuracy is insufficient and may misidentify good components as defective
Solution Approach 1:
The system dynamically switches between different imaging conditions (reflection illumination, transmission illumination, laser illumination) based on the specific recognition needs and component characteristics. The imaging device can adaptively select and change illumination types and angles during the recognition process, making the system flexible rather than static.
Solution Approach 2:
The system changes multiple imaging parameters including illumination type (reflection, transmission, laser), illumination angle, and exposure settings to capture electrode positions from different perspectives. By varying these parameters, the system obtains multiple image datasets that complement each other, improving overall recognition accuracy.
2Reliability
If multiple imaging conditions are used to improve recognition accuracy, then electrode position detection becomes more reliable, but the recognition time and processing complexity increase
Solution Approach 1:
The system performs preliminary imaging using reflection illumination first, which is quick and provides initial electrode position information. Based on this preliminary data, the system determines whether additional imaging with transmission or laser illumination is necessary, avoiding unnecessary imaging steps and reducing overall processing time.
Solution Approach 2:
The system uses feedback from preliminary recognition results to control subsequent imaging actions. If the initial recognition confidence is sufficient, the system stops there. If not, it triggers additional imaging with different illumination conditions, creating a feedback-driven adaptive recognition process that balances accuracy and speed.
3Adaptability or versatility
If multiple light sources and imaging conditions are employed, then the system can handle various component types and imaging scenarios, but the device complexity and cost increase
Solution Approach 1:
The imaging device is designed with multi-functionality to perform multiple imaging tasks using different illumination types (reflection, transmission, laser). A single imaging device structure accommodates various illumination configurations, allowing it to handle diverse component types and recognition scenarios without requiring entirely separate systems for each function.
Solution Approach 2:
The control device serves as an intermediary that coordinates between multiple light sources and the imaging device. It manages the complex interactions and timing of different illumination sources, processing the combined image data to produce accurate electrode position recognition, thereby simplifying the overall system architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables accurate recognition of electrode positions by switching between different imaging conditions, reducing the likelihood of misidentifying good components as defective and improving the reliability of component mounting processes.
Implementation Method 1
an imaging device configured to image the component based on light reflected by the component when light is applied to the component from at least one of the multiple light sources
Data Source
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AI summary
Leaded component 100 held by suction nozzle 66 is imaged under three types of imaging conditions, imaging in a state illuminated by laser illumination 116, imaging in a state illuminated by incident illumination 114, and imaging in a state illuminated by side illumination 112 and incident illumination 114. In a case in which it is not possible to appropriately recognize a position of a lead 104 by recognition processing using image data of the first set of imaging conditions, recognition processing is performed again using image data of a second set of imaging conditions different to the first set of imaging conditions. And, in a case in which it is not possible to appropriately recognize a position of a lead by recognition processing using image data of the second set of imaging conditions, recognition processing is performed again using image data of a third set of imaging conditions different to the second set of imaging conditions. In this manner, it is possible to appropriately recognize a tip of lead by performing recognition processing based on three types of image data with different imaging conditions.