Reconfigurable Antenna Pad Layout for Low-Loss RF Coupling
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Solution Overview
Problem
Conventional antenna packages face performance issues due to molding compounds affecting antenna performance, and there is a need for flexible electrical coupling of different antenna units to support higher data rates and increased functionality.
Innovation Solution
An electronic device with a carrier and an interconnection structure that includes adjustable conductive pads and a detachable antenna unit, allowing for flexible electrical coupling of various antenna units without the use of molding compounds, which enhances design flexibility and reduces manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If molding compound is used to encapsulate the antenna layer and RF routing layer, then structural protection is provided, but antenna performance deteriorates due to signal transmission loss
Solution Approach 1:
The patent removes the molding compound from the antenna package structure entirely. The antenna layer and RF routing layer are exposed without encapsulation, eliminating the dielectric material that caused signal transmission loss while maintaining structural integrity through alternative support mechanisms.
Solution Approach 2:
The patent changes the physical state and material composition of the package structure by eliminating the molding compound. This parameter change transforms the package from an enclosed, protected structure to an open structure that prioritizes RF signal quality over mechanical protection.
2Ease of manufacture
If fixed antenna units are used in the antenna package, then manufacturing simplicity is maintained, but adaptability deteriorates as different antenna configurations cannot be supported
Solution Approach 1:
The patent introduces reconfigurability to the antenna package by enabling dynamic switching between different antenna units. The RF routing layer is designed with switchable connections that allow different antenna configurations to be activated based on operational requirements, transforming a static structure into a dynamic system.
Solution Approach 2:
The patent designs the RF routing layer and interconnection structure to support multiple antenna units with different frequencies and configurations. This universal design allows a single package structure to accommodate various antenna types, making the system multi-functional and adaptable to different communication standards.
3Adaptability or versatility
If multiple antenna units with different configurations are electrically coupled to the same RF routing layer, then adaptability is improved, but device complexity increases
Solution Approach 1:
The patent segments the antenna package into modular antenna units that can be independently configured and connected to the RF routing layer. Each antenna unit is designed as a separate module with standardized connection interfaces, simplifying the overall integration process despite supporting multiple configurations.
Solution Approach 2:
The patent implements a hierarchical structure where antenna units are nested within the package and connected to the RF routing layer through layered interconnections. The RF routing layer is positioned between the antenna units and the carrier, creating a nested arrangement that manages complexity through organized layering.
Data Source
AI summary
The present disclosure provides an electronic device. The electronic device includes a carrier and an interconnection structure disposed over the carrier and having a plurality of conductive pads. One of the plurality of conductive pads is adjustable to function as a functional pad or a non-functional pad for an antenna unit.