Reconfigurable Bond Wire Connection Matrices for SiP Substrates
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Solution Overview
Problem
There is a need for a configuration of a common substrate with one or more connection matrices for System in a Package (SiP) devices to achieve increased system flexibility and versatility, as existing SiP designs lack the ability to efficiently customize electrical connections between components without requiring multiple substrates or complex manufacturing processes.
Innovation Solution
The use of a substrate with one or more bond wire connection arrays or matrices that can be programmed differently to accommodate various systems by strategically placing bond wires on pads, allowing for unique electrical connections and reconfiguration, using a database to instruct the placement of components and bond wires, and employing optimization criteria for optimal interconnection patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a common substrate is used for multiple SiP systems, then manufacturing complexity is reduced and productivity increases, but the ability to customize electrical connections between components deteriorates
Solution Approach 1:
The substrate incorporates reconfigurable connection matrices that can dynamically change their electrical connection patterns. Bond wires are strategically placed to create different interconnection topologies between components based on the specific system requirements, allowing a single substrate to adapt to multiple different SiP configurations without requiring physical reconfiguration of the substrate structure itself.
Solution Approach 2:
The substrate design implements localized connection matrices with selectively enabled/disabled interconnection paths. Different regions of the substrate can be programmed to provide different connection patterns, allowing customization at the local level while maintaining a common substrate structure. This enables tailored electrical connections for specific component placements without affecting the entire substrate design.
2Adaptability or versatility
If multiple substrates are used to achieve system customization, then adaptability improves, but device complexity and manufacturing cost increase
Solution Approach 1:
A single substrate is designed to perform multiple functions by incorporating reconfigurable connection matrices that can be programmed for different SiP system configurations. The substrate serves as a universal platform that can accommodate various component types and interconnection patterns through strategic bond wire placement, eliminating the need for multiple specialized substrates while maintaining full customization capability.
Solution Approach 2:
The substrate is divided into multiple independent connection matrices that can be independently configured. Each matrix can be programmed to provide specific connection patterns for different system requirements, allowing the overall substrate to support multiple different SiP configurations simultaneously or sequentially without requiring the entire substrate to be redesigned.
3Adaptability or versatility
If bond wires are strategically placed on connection matrices, then system flexibility and reconfiguration capability improve, but manufacturing precision requirements increase
Solution Approach 1:
Bond wire placement locations are pre-determined and pre-programmed into the connection matrices during substrate fabrication. The reconfigurable interconnection paths are established in advance through strategic bond wire placement, allowing the substrate to be manufactured with fixed wire locations that can later be programmatically configured for different system requirements without requiring high-precision wire placement during final assembly.
Data Source
AI summary
Systems and methods to translate or convert a desired circuit into a database that instructs a place and route or wire bonding machine where on a substrate to place components and also where to place bond wires on the pads of a connection matrix on a substrate. During the assembly process, the pads of the connection matrix are populated with bond wires using the database.