Chiplet Arrangement Modeling for Reconfigurable Hardware-Software Integration

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Solution Overview

Problem

The limitations of monolithic chip design, including economic constraints, supply/demand challenges, flexibility, and competitiveness, hinder the development of smaller-scale chips, while existing chiplet solutions lack full exploitation of their potential due to isolated hardware and software configurability.

Innovation Solution

A method for modeling and simulating reconfigurable hardware and software solutions for chiplet arrangements, involving the creation of a chiplet arrangement hardware model, estimating a microsystem hardware model, and simulating software capabilities to optimize and validate microservices for deployment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If monolithic chip design is used, then manufacturing simplicity is maintained, but flexibility and adaptability are reduced

Engineering Contradiction:
ImproveflexibilityVSAvoiddesign complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent applies segmentation by dividing the monolithic chip design into separate chiplet modules that can be independently designed, manufactured, and configured. Each chiplet represents a functional segment that can be selectively activated or deactivated, enabling flexible system reconfiguration without redesigning the entire chip architecture.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent implements dynamics through runtime reconfiguration capabilities where chiplet arrangements can be dynamically modified based on workload requirements. The system allows for changing the active chiplet configuration during operation, enabling adaptability to different computational tasks without physical hardware changes.

Inventive Principle:
Principle #15Dynamics

2Adaptability or versatility

If chiplet arrangements are used, then flexibility and scalability are improved, but hardware and software integration complexity increases

Engineering Contradiction:
ImprovescalabilityVSAvoidintegration complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent applies universality by creating a standardized chiplet interface and communication protocol that enables different chiplet types to work together in a unified architecture. The universal interface allows various functional chiplets (accelerators, memory, I/O) to be interchangeably configured, simplifying integration while maintaining scalability.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent introduces an intermediary layer (interposer or interface controller) that manages communication and coordination between multiple chiplets. This intermediary handles the complexity of inter-chiplet interactions, allowing individual chiplets to remain simple while the system achieves complex functionality through coordinated operation.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If hardware resources are dedicated to specific functions, then performance is optimized, but resource utilization efficiency decreases

Engineering Contradiction:
ImproveperformanceVSAvoidresource utilization
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent implements dynamic resource allocation where chiplet functions can be reconfigured based on runtime workload requirements. Hardware resources are not permanently dedicated but can be dynamically assigned to different functions, maintaining high performance for current tasks while enabling efficient utilization across varying workloads through reconfiguration.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent applies parameter changes by modifying the operational state of chiplet resources rather than their physical configuration. Through changing control parameters and activation states, the same hardware resources can be optimized for different functions, achieving both performance optimization and efficient utilization without physical reconfiguration.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentEP4597353A1Chiplet arrangement modeling
Publication Date: 2025.08.06 LTU LICENS AB
  • EP4597353A1 patent drawingFigure 1~3
  • EP4597353A1 patent drawingFigure 4~5
  • EP4597353A1 patent drawingFigure 6

AI summary

A method (600) is presented. The method (600) comprise obtaining (610) an engineering plan and a chiplet arrangement hardware model. The method (600) further comprises estimating (630) a microsystem hardware model based on the hardware requirements and a hardware data set describing hardware resources of the chiplet arrangement and simulating (640) the estimated microsystem hardware model by electrical simulations to provide one or more hardware capabilities. The method (600) further comprises obtaining (650) a chiplet arrangement environment model and estimating (660) a microsystem software model using the hardware capabilities and the software requirements. The method (600) further comprises simulating (670) the estimated microsystem software model on the chiplet arrangement environment model to provide one or more software capabilities and compiling (680) the estimated microsystem hardware model, the estimated microsystem software model, the one or more hardware capabilities, the one or more software capabilities to a microsystem model comprising one or more microsystem capabilities.