Reconfigurable Modular Cooling Assembly for IC Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing thermal solutions for high-powered semiconductor packages have fixed designs that cannot be modified after deployment, leading to inadequate thermal management and heat dissipation challenges.
Innovation Solution
A reconfigurable modular cooling assembly that includes a core base assembly and reversibly coupled attachment members, allowing for scalable thermal performance by adding or removing heat sink capacity based on power dissipation requirements, using thermally conductive materials like copper and stainless steel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a fixed thermal solution is used for semiconductor packages, then the design is simple and cost-effective, but the thermal management cannot be adapted to changing power dissipation requirements after deployment
Solution Approach 1:
The cooling assembly is divided into a core base assembly and multiple detachable attachment members. Each attachment member can be independently added or removed based on power dissipation requirements, enabling modular thermal management that adapts to changing conditions without requiring complete system replacement.
Solution Approach 2:
The cooling assembly transitions from a static fixed design to a dynamic reconfigurable system. Attachment members can be reversibly coupled to or decoupled from the core base assembly, allowing the thermal management system to adapt its configuration in response to varying power dissipation demands of the integrated circuitry.
2Temperature
If heat sink capacity is increased to handle high power dissipation, then thermal management performance improves, but the cost and energy consumption increase
Solution Approach 1:
Instead of providing full heat sink capacity for maximum power dissipation from the outset, the system uses attachment members that can be added incrementally. This allows thermal management capacity to match actual power dissipation needs, avoiding the energy waste and cost associated with always deploying maximum cooling capacity.
3Adaptability or versatility
If a reconfigurable modular cooling assembly is implemented, then thermal management adaptability improves, but the device complexity and manufacturing cost increase
Solution Approach 1:
The cooling assembly is divided into a core base assembly and multiple detachable attachment members. Each attachment member can be independently added or removed based on power dissipation requirements, enabling modular thermal management that adapts to changing conditions without requiring complete system replacement.
4Temperature
If attachment members are added to increase heat dissipation capacity, then thermal performance improves, but the physical size and weight of the cooling assembly increase
Solution Approach 1:
The cooling assembly is divided into a core base assembly and multiple detachable attachment members. Each attachment member can be independently added or removed based on power dissipation requirements, enabling modular thermal management that adapts to changing conditions without requiring complete system replacement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables agile thermal management, maintaining optimal temperatures across a wide range of power dissipation levels, from portable devices to high-performance computing systems, while reducing costs and energy consumption through modular design and incremental deployments.
Implementation Method 1
the pedestal member comprising a first thermally conductive material... each of the one or more attachment members comprising a respective second thermally conductive material... configured to receive a respective second amount of heat from the pedestal member
Data Source
AI summary
Reconfigurable cooling assemblies for thermal management of integrated circuitry are provided. Such assemblies can be modular and can permit or otherwise facilitate scalable thermal performance with respect to power dissipation demands. In some embodiments, a reconfigurable modular cooling assembly can be reversibly configured to adjust reversibly the cooling capacity of the assembly for a defined power dissipation requirement. A form factor of a reconfigurable modular cooling assembly can be based at least on the defined power dissipation requirement. In some embodiments, a reconfigurable modular cooling assembly can include a pedestal member and multiple attachment members that can be reversibly coupled to or reversibly decoupled from the pedestal based at least on a power dissipation condition and/or a change thereof in a dissipative electronic component included in a semiconductor package. Scalability of thermal performance of the reconfigurable modular cooling assembly can be achieved, at least in part, by the addition of attachment members.