Reconfigurable Data Distribution System for Vehicle Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current comprehensive networked systems in specialized vehicles face challenges such as complex production processes, hindered market speed, increased physical footprint, and lower mean-time-before-failure due to the integration of commercial and custom components using custom cabling harnesses, which complicates testing and reduces efficiency.
Innovation Solution
A reconfigurable data distribution system integrated onto a single circuit board, featuring a dedicated microprocessor, CPU host, interfaces, video encoder, communication hub, and switch matrix, which enables flexible data routing and passive cooling, reducing the system's size and improving production flow while enhancing reliability and scalability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If commercial and custom components are integrated using custom cabling harnesses, then system functionality is achieved, but device complexity and production time increase
Solution Approach 1:
The patent merges multiple previously separate components (microprocessor, memory, display interfaces, camera interfaces, cooling components) into a single integrated circuit board. This consolidation eliminates the need for custom cabling harnesses and reduces the number of discrete parts, thereby reducing device complexity while maintaining full system functionality.
Solution Approach 2:
The integrated circuit board serves multiple functions simultaneously - processing data, displaying information, capturing images, and managing thermal conditions. By designing a universal platform that can handle various data types and display modes, the system achieves adaptability without requiring separate specialized components for each function.
2Adaptability or versatility
If multiple separate components are used, then functional requirements are met, but physical footprint increases
Solution Approach 1:
The patent combines multiple functional components into a single integrated circuit board, significantly reducing the physical footprint. The microprocessor, memory, display interfaces, camera interfaces, and cooling components are all integrated onto one board, eliminating the need for separate component housings and interconnection cables that would otherwise occupy space.
3Temperature
If active cooling components are used, then thermal management is achieved, but reliability decreases
Solution Approach 1:
The patent replaces active mechanical cooling components (such as fans or pumps) with a passive cooling system integrated into the circuit board. The passive cooling mechanism uses natural convection and thermal conduction through the board structure, eliminating moving parts that would reduce reliability while still achieving effective thermal management.
4Ease of operation
If custom cabling harnesses are used for integration, then component connectivity is achieved, but manufacturing efficiency decreases
Solution Approach 1:
The patent integrates all components directly onto a single circuit board using standardized PCB connection methods, eliminating the need for custom cabling harnesses. This approach simplifies manufacturing processes, reduces assembly steps, and increases production speed while maintaining reliable component connectivity through established PCB trace and connector technologies.
Data Source
AI summary
Systems, apparatus, and methods for a reconfigurable integrated system integrated onto a single circuit board are described herein. An embodiment includes a CPU host and microprocessor which attach and manage internal and external peripheral devices. Data received from sensors may include video data. Any data input may be routed by the system so as to be output at any display connected to the system. The enclosure of the integrated system may be a conformal heat sink design that enables a passively cooled system. The data may be in analog or digital format for output by the reconfigurable integrated system.