Reconfigurable Fiber-Optic Interconnection Tray with Mezzanine

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional optical fiber interconnection trays face challenges in expanding capacity at fiber access points due to volume constraints and installation requirements, limiting the ability to increase the number of optical fiber splices and accommodate growing network demands.

Innovation Solution

A reconfigurable interconnection tray design featuring a base with a first interconnection layer and a second interconnection layer positioned on a repositionable mezzanine, allowing for increased optical fiber interconnection capacity by doubling the splice density through the use of repositionable mezzanines that can be secured at multiple locations along the tray, enabling flexible configuration and expansion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If another tray is added to increase the number of optical fiber splices, then the splice capacity is improved, but the volume constraints and installation requirements prevent this solution from being feasible

Engineering Contradiction:
Improvesplice capacityVSAvoidenclosure volume
Core Design Contradiction:
Quantity of substanceVSVolume of moving object

Solution Approach 1:

The patent transitions from a single-layer tray configuration to a multi-layer stacked configuration, utilizing the vertical dimension to increase splice capacity. Multiple interconnection layers are stacked vertically within the same tray footprint, effectively doubling or tripling the number of splices that can be accommodated without increasing the horizontal enclosure volume.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent implements nested interconnection layers where one layer is positioned directly over another within the same tray structure. The layers are nested vertically, with each layer containing splice trays that can be stacked one inside another, maximizing the use of available vertical space within the enclosure volume constraints.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Ease of manufacture

If the tray design is made fixed and simple, then the manufacturing and installation are easier, but the adaptability to different network configurations and capacity expansion needs is reduced

Engineering Contradiction:
Improvetray manufacturing simplicityVSAvoidconfiguration flexibility
Core Design Contradiction:
Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The interconnection tray is divided into modular segments including multiple independent interconnection layers, repositionable mezzanines, and separate splice tray units. Each layer can be independently configured, installed, and adjusted to match specific network requirements, allowing the same basic tray design to adapt to different capacity needs and configurations.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent incorporates repositionable mezzanines that can be moved to different positions within the tray, allowing dynamic reconfiguration of the interconnection layers. The mezzanines can be repositioned to accommodate different numbers of splices, different cable entry points, and varying network topology requirements, providing flexibility without changing the overall tray structure.

Inventive Principle:
Principle #15Dynamics

Data Source

PatentEP3259630B1Highly configurable fiber-optic interconnection tray
Publication Date: 2021.09.15 CORNING RES & DEV CORP
  • EP3259630B1 patent drawingFigure 1
  • EP3259630B1 patent drawingFigure 2
  • EP3259630B1 patent drawingFigure 3A

AI summary

The present description relates to an optical fiber interconnection tray. The interconnection tray has a base extending longitudinally from a first end to a second end, with a cable entrance at the first end of the tray. A first interconnection layer is disposed on the base, and a second interconnection layer is positioned over at least a portion of the first interconnection layer, wherein the second interconnection layer is disposed on a first repositionable mezzanine attached to the base at a plurality of locations.