Reconfigurable Form Board for Wire Bundle Assembly

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Solution Overview

Problem

The existing methods for assembling wire bundles in aircraft require high costs due to the need for customized form boards for each configuration, which are time-consuming to design and store, and do not allow for quick reconfiguration or efficient use of space in manufacturing environments.

Innovation Solution

Automation technology is employed to robotically assemble form boards, route wires, and apply plastic ties, with software generating robot control files from engineering data to quickly design and reconfigure form boards based on changing wire bundle configurations, eliminating the need for storage and optimizing production workflows.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If customized form boards are created for each wire bundle configuration, then manufacturing precision is improved, but device complexity and loss of time increase due to the need to create, maintain, store, and set-up multiple form boards

Engineering Contradiction:
Improvewire bundle configuration accuracyVSAvoidform board management complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

A single reconfigurable form board is designed to serve multiple wire bundle configurations through movable and adjustable form board devices. These devices can be repositioned along the form board to accommodate different wire routing patterns, eliminating the need for multiple dedicated form boards for different configurations.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The form board incorporates movable form board devices that can be dynamically repositioned to different locations on the form board. This dynamic reconfigurability allows the same physical form board to adapt to various wire bundle configurations without requiring creation of new form boards, thereby reducing management complexity while maintaining manufacturing precision.

Inventive Principle:
Principle #15Dynamics

2Adaptability or versatility

If multiple customized form boards are maintained for different configurations, then adaptability is improved, but loss of time and productivity decrease due to setup delays when switching between configurations

Engineering Contradiction:
Improveconfiguration flexibilityVSAvoidform board setup time
Core Design Contradiction:
Adaptability or versatilityVSLoss of time

Solution Approach 1:

The form board uses movable form board devices that can be quickly repositioned to different locations to accommodate different wire bundle configurations. This dynamic repositioning capability eliminates the time-consuming process of setting up new form boards for each configuration change, while maintaining full adaptability to various wire routing requirements.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The form board devices are designed to be pre-configured and stored in ready positions, allowing for rapid deployment when configuration changes are needed. The movable nature of these devices enables them to be quickly moved to predetermined locations for different configurations, reducing setup time while maintaining adaptability.

Inventive Principle:
Principle #10Preliminary action

3Manufacturing precision

If individual form boards are created and stored for each configuration, then manufacturing precision is improved, but area of stationary object increases due to storage space requirements

Engineering Contradiction:
Improveconfiguration accuracyVSAvoidstorage space
Core Design Contradiction:
Manufacturing precisionVSArea of stationary object

Solution Approach 1:

A single reconfigurable form board replaces multiple dedicated form boards, eliminating the need for extensive storage space. The form board can be reconfigured for different wire bundle types through movable devices, maintaining manufacturing precision while significantly reducing the area required for storing form boards.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

Multiple form board functions are merged into a single reconfigurable form board. By combining the capabilities of what would otherwise require multiple separate form boards into one unified system with movable components, the storage space requirement is reduced while preserving the ability to achieve precise configurations for different wire bundles.

Inventive Principle:
Principle #5Merging (Combining)

4Ease of manufacture

If manual form board creation methods are used, then ease of manufacture is improved, but productivity decreases due to high costs and time consumption

Engineering Contradiction:
Improveform board fabrication simplicityVSAvoidwire bundle assembly rate
Core Design Contradiction:
Ease of manufactureVSProductivity

Solution Approach 1:

The form board system uses movable and reconfigurable devices that can be quickly adjusted for different configurations without requiring manual fabrication. This dynamic reconfigurability maintains the simplicity of using pre-fabricated components while dramatically improving productivity by eliminating the time-consuming process of creating new form boards for each configuration.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

A single universal form board with movable devices replaces the need for multiple custom-fabricated form boards. This approach maintains ease of manufacture by using standardized components that can be reused, while improving productivity through rapid reconfiguration capabilities that eliminate fabrication and storage requirements.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS11489309B2Form board preparation for wire bundling
Publication Date: 2022.11.01 THE BOEING CO
  • US11489309B2 patent drawing
  • US11489309B2 patent drawing
  • US11489309B2 patent drawing

AI summary

Systems and methods for designing and assembling form boards with attached wire routing devices for use in wire bundle assembly. The assembly method comprises: (a) establishing a coordinate system of a form board having a multiplicity of holes; (b) using a computer system to determine locations of form board devices of different types with reference to the coordinate system of the form board based on engineering data specifying a wire bundle configuration; and (c) fastening the form board devices of different types to respective holes of the form board having centers closest to respective locations determined in step (b). The form board devices may be inserted robotically or manually.