Reconfigurable Heated Chuck Plate for Soldering
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing heated chuck plates for solder dispensers require replacement for different heating patterns, posing safety risks and adding costly downtime due to their high temperature and inefficiencies in heating only specific areas.
Innovation Solution
A reconfigurable heated chuck plate with an air channel network that includes multiple heating pathways and ports with set screws, allowing for easy switching between heating patterns without the need for physical replacement, ensuring safety and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a heated chuck plate with fixed heating pattern is used, then the heating pattern is stable and reliable, but the chuck plate must be replaced for different substrates requiring different heating patterns, causing downtime and safety issues
Solution Approach 1:
The patent implements a reconfigurable heating system where the heating pathways can be dynamically adjusted through a valve mechanism. The valve can be opened or closed to enable different heating pathways (first, second, or both simultaneously), allowing the same chuck plate to adapt to different substrate heating requirements without physical replacement.
Solution Approach 2:
The chuck plate is designed with multiple heating pathways and a valve mechanism that enables a single device to perform multiple heating functions. The first heating pathway can heat a first location, the second heating pathway can heat a second location, and both can operate simultaneously, making one chuck plate universal for various substrate types.
2Temperature
If the chuck plate is heated to high temperature for effective heating, then the heating efficiency is improved, but the chuck plate becomes dangerous to handle and requires cooling time before replacement
Solution Approach 1:
The valve mechanism allows operators to dynamically control which heating pathways are active. When high temperature is needed for effective heating, the valve can be positioned to enable the appropriate pathway. When replacement is needed, the valve can be closed to stop heating, allowing safe handling without waiting for full cooling.
Solution Approach 2:
The system includes temperature sensors and control logic that automatically monitor and regulate the chuck plate temperature. The system can self-adjust the heating pathways based on temperature feedback, maintaining optimal heating temperature while preventing excessive heat that would create safety hazards during handling.
3Adaptability or versatility
If infrared heating is applied to the entire substrate to cover all heating patterns, then all areas are heated uniformly, but unnecessary areas are heated which may alter or damage previous soldering work
Solution Approach 1:
The chuck plate features localized heating pathways that direct heated air to specific locations on the substrate. The first heating pathway targets a first location while the second heating pathway targets a second location, allowing precise local heating only where needed rather than heating the entire substrate, thus preventing damage to areas that don't require heating.
Solution Approach 2:
The heating system is divided into separate, independently controllable heating pathways. Each pathway can be activated or deactivated through the valve mechanism, allowing selective heating of different substrate regions. This segmentation enables precise control over which areas receive heat, avoiding unnecessary heating of sensitive areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables safe and efficient switching between different heating patterns on electronic substrates, reducing manufacturing downtime and maintaining high-quality soldering processes without the need for frequent chuck plate replacements.
Implementation Method 1
an air channel network configured to selectively direct heated air to a plurality of predetermined locations on the electronic substrate
Data Source
AI summary
Heated chuck plates and apparatus using the same where a heated chuck or tooling plate has a body including an external surface, the body configured to secure an electronics assembly near the external surface, and an air channel network configured to selectively direct heated air to a plurality of predetermined locations on the electronics assembly, the air channel network including: a first heating pathway configured to direct the heated air through the external surface and onto a first location of the plurality of predetermined locations, and a second heating pathway configured to direct the heated air through the external surface and onto a second location of the plurality of predetermined locations.