Reconfigurable Microelectronic Package Security via Dynamic Switching

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Solution Overview

Problem

Current microelectronic packages have static data pathways that are vulnerable to hacking and malicious interference, particularly in medical devices where secure data transfer is critical, as adversaries can exploit knowledge of internal hardware and sensor configurations to attack the system.

Innovation Solution

Integration of reconfigurable switches within the microelectronic package allows for dynamic switching of data pathways, providing an additional security layer through encryption and authentication, using piezoelectric or thermally actuated switches to alter signal pathways and prevent unauthorized access.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If static data pathways are used in microelectronic packages, then manufacturing is simpler and more cost-effective, but security is compromised as adversaries can exploit knowledge of internal hardware configurations

Engineering Contradiction:
ImprovesecurityVSAvoidpackage structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent implements reconfigurable data pathways using MEMS switches that can dynamically change their state between connected and disconnected positions. This allows the package to transition from static to dynamic routing, where signal pathways can be reconfigured at runtime to prevent adversaries from exploiting fixed hardware configurations. The MEMS switches enable the system to adapt its data transmission routes based on security requirements.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent divides the data transmission pathways into multiple segments controlled by individual MEMS switches. Each switch can independently control a specific segment of the data path, allowing granular security management. This segmentation enables selective activation or deactivation of specific routing paths without affecting the entire system, thereby enhancing security while maintaining manageable complexity.

Inventive Principle:
Principle #1Segmentation

2Reliability

If reconfigurable switches are integrated into the package, then security is enhanced through dynamic pathway switching, but device complexity increases

Engineering Contradiction:
ImprovesecurityVSAvoidswitch integration
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces traditional mechanical or software-based switching mechanisms with MEMS (Micro-Electro-Mechanical Systems) switches integrated directly into the package substrate. This substitution provides a middle ground between purely mechanical and purely electronic systems, offering dynamic reconfigurability with lower power consumption and smaller form factor, thereby enhancing security without proportionally increasing device complexity.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The MEMS switches are designed to perform multiple functions: they serve as both security control elements for pathway reconfiguration and as standard electrical switches for signal transmission. This multi-functionality reduces the need for separate security-specific components, thereby enhancing security capabilities while minimizing the increase in overall device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If multiple encryption pathways are implemented, then resistance to hacking increases, but manufacturing precision requirements increase

Engineering Contradiction:
Improvehacking resistanceVSAvoidswitch placement
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent utilizes the ability of MEMS switches to change their physical state (connected or disconnected) as a controllable parameter for security routing. By changing the state parameter of individual switches, the system can dynamically create or eliminate encryption pathways without requiring physical reconfiguration or additional manufacturing steps, thereby enhancing hacking resistance while maintaining standard manufacturing precision requirements.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances security by increasing the difficulty of hacking, ensuring no single point of failure, and providing redundancy without additional power consumption, while ensuring only valid and encrypted signals initiate responses in medical devices.

Implementation Method 1

The switch may include a piezoelectric layer formed between a first electrode and a second electrode

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Implementation Method 2

The first and second portions may include a bi-metallic structure

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS10116504B2Package integrated security features
Publication Date: 2018.10.30 INTEL CORP
  • US10116504B2 patent drawing
  • US10116504B2 patent drawing
  • US10116504B2 patent drawing

AI summary

Embodiments of the invention include a physiological sensor system. According to an embodiment the sensor system may include a package substrate, a plurality of sensors formed on the substrate, a second electrical component, and an encryption bank formed along a data transmission path between the plurality of sensors and the second electrical component. In an embodiment the encryption bank may include a plurality of portions that each have one or more switches integrated into the package substrate. In an embodiment each sensor transmits data to the second electrical component along different portions of the encryption bank. In some embodiments, the switches may be piezoelectrically actuated. In other embodiments the switches may be actuated by thermal expansion. Additional embodiments may include tri- or bi-stable mechanical switches.