Reconfigurable Integrated RF Front-End for Dual-Band WLAN

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Solution Overview

Problem

Existing dual-band WLAN transceivers require separate components for RF Front-End circuitry, leading to increased complexity, cost, and power consumption, as well as larger device sizes due to the need for distributed modules and external filtering components.

Innovation Solution

A reconfigurable integrated RF Front-End circuitry is implemented on a CMOS chip with fully integrated harmonic traps, featuring transmitter and receiver configuration switches and harmonic trap filters, allowing for dual-band operation without external components, reducing circuitry and enhancing integration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If separate components are used for RF Front-End circuitry in dual-band WLAN transceivers, then frequency domain multiplexing and dual-band operation are achieved, but device complexity, cost, and power consumption increase

Engineering Contradiction:

Improvedual-band operation capabilityVSAvoidcircuitry complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent combines multiple RF Front-End functions (harmonic trap filters, diplexer, switches) into a single integrated circuit chip. The harmonic trap circuitry is fully integrated on the CMOS die, and the diplexer component is merged with switching circuitry to form a unified RF Front-End module that handles both 2.4 GHz and 5 GHz bands through integrated circuitry rather than separate discrete components.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The integrated RF Front-End circuitry is designed to perform multiple functions within a single chip: it provides harmonic filtering, frequency domain multiplexing, signal routing for transmit and receive modes, and dual-band operation. The configuration switches enable the same circuitry to adaptively perform different functions depending on the operational mode, making the system universal rather than requiring dedicated components for each function.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If separate components are used for RF Front-End circuitry, then dual-band WLAN transceiver functionality is achieved, but device size increases

Engineering Contradiction:

Improvedual-band transceiver functionalityVSAvoiddevice size

Core Design Contradiction:

Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The patent integrates all RF Front-End components onto a single CMOS die, merging what would traditionally be separate discrete components (harmonic traps, diplexer, switches, amplifiers) into one compact integrated circuit. This consolidation dramatically reduces the physical area required compared to distributed modules and external filtering components.

Inventive Principle:

Principle #5Merging (Combining)

3Adaptability or versatility

If separate components are used for RF Front-End circuitry, then dual-band operation is achieved, but power consumption increases

Engineering Contradiction:

Improvedual-band operationVSAvoidpower consumption

Core Design Contradiction:

Adaptability or versatilityVSUse of energy by moving object

Solution Approach 1:

The integration of RF Front-End functions onto a single CMOS die reduces power consumption by eliminating the need for multiple separate power supplies and reducing signal path losses associated with external connections. The shared circuitry and switches enable efficient power management for dual-band operation.

Inventive Principle:

Principle #5Merging (Combining)

4Adaptability or versatility

If separate components are used for RF Front-End circuitry, then frequency domain multiplexing is achieved, but manufacturing cost increases

Engineering Contradiction:

Improvefrequency domain multiplexing capabilityVSAvoidmanufacturing cost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent implements frequency domain multiplexing through integrated circuitry on a single CMOS die rather than requiring separate discrete components. This integration reduces the number of assembly steps, eliminates the need for external component mounting and tuning, and enables standard CMOS manufacturing processes, thereby reducing overall manufacturing cost despite the increased functional complexity.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS9998167B2Reconfigurable integrated RF front-end for dual-band WLAN transceivers

Publication Date: 2018.06.12 MARVELL ASIA PTE LTD

AI summary

Systems and techniques relating to wireless communication devices and reconfigurable an integrated RF Front-End for dual-band WLAN transceivers include, according to an aspect, an integrated circuit chip comprising: radio frequency (RF) Front-End circuitry, wherein the RF Front-End circuitry comprises (i) an antenna input line configured to connect with one or more antennas of a wireless communication device, (ii) a transmitter input line, (ii) a first receiver output line, (iii) and a second receiver output line; harmonic trap circuitry coupled with the RF Front-End circuitry via the antenna input line, the harmonic trap circuitry being fully integrated on the integrated circuit chip.