Reconfigurable Output Matching Circuit for Multi-Band RF Amplifiers
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Solution Overview
Problem
Existing high frequency amplifier circuits in mobile communication devices face challenges in accurately establishing impedance matching for multiple communication modes/multiple bands due to fixed circuit constants of passive elements, leading to increased size and difficulty in adjusting output load impedance for different frequency bands.
Innovation Solution
A high frequency circuit with a semiconductor integrated circuit that includes a power amplifier, low-noise amplifier, and switching circuits, along with external passive elements, allows for precise impedance matching by switching between different matching circuits to optimize output load impedance for various communication modes, such as Wi-Fi and Bluetooth, using a single chip configuration to minimize size while maintaining flexibility in circuit constants.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If fixed circuit constants of passive elements are used in the output matching circuit, then the circuit structure is simple, but it is impossible to highly accurately establish impedance matching for both high frequency signals in adjacent or overlapping different frequency bands
Solution Approach 1:
The patent implements dynamic impedance matching by making the output matching circuit reconfigurable through switching elements. The matching circuit can dynamically adjust its configuration to provide different output load impedances for different frequency bands and communication modes, thereby achieving high impedance matching accuracy across multiple bands without requiring separate fixed circuits for each band.
Solution Approach 2:
The patent changes the electrical parameters of the output matching circuit by using switching elements to connect different passive elements (inductors and capacitors) in different configurations. This allows the circuit to adjust its impedance characteristics dynamically, providing optimal impedance matching for different frequency bands and communication modes while maintaining a single unified circuit structure.
2Measurement precision
If switching means is added to the output matching circuit to enable impedance matching for multiple frequency bands, then impedance matching accuracy improves, but the size of the high frequency amplifier circuit is increased
Solution Approach 1:
The patent merges the impedance matching function for multiple frequency bands into a single unified output matching circuit. By combining multiple passive elements (inductors and capacitors) with switching elements in one integrated circuit, the patent achieves impedance matching for multiple bands without requiring separate matching circuits for each band, thereby reducing the overall circuit size while maintaining high matching accuracy.
Solution Approach 2:
The patent designs the output matching circuit to be universal and multi-functional, capable of providing optimal impedance matching for different frequency bands and communication modes through a single circuit configuration. The switching elements enable the same circuit to serve multiple functions (matching for Band 1, Band 2, and other bands) without requiring separate dedicated circuits for each function.
3Measurement precision
If separate output matching circuits are designed for different frequency bands, then impedance matching accuracy for each band is high, but the device complexity and size increase
Solution Approach 1:
The patent implements a dynamic output matching circuit that can adapt its configuration based on the operating frequency band and communication mode. The switching elements enable the circuit to dynamically reconfigure itself to provide optimal impedance matching for different bands, achieving both high matching accuracy and multi-band compatibility within a single unified circuit structure.
Data Source
AI summary
A high frequency circuit includes a transmit terminal and a transmit and receive terminal, a power amplifier that amplifies a high frequency signal inputted from the transmit terminal and outputs the high frequency signal toward the transmit and receive terminal, and an output matching circuit that is positioned on a signal path connecting the power amplifier and the transmit and receive terminal and that optimizes the output load impedance of the power amplifier. The output matching circuit includes a matching circuit coupled to an output terminal of the power amplifier, another matching circuit, and a switch that changes a connection between the matching circuits. The power amplifier and the switch are formed at a single semiconductor IC. The matching circuits are formed outside the semiconductor IC.