Reconfigurable Via Substrate Layout for Multi-Component Compatibility
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional substrates require customization of via arrangements for different external electrical components, leading to increased time and cost in development and manufacturing.
Innovation Solution
An electronic device with a substrate featuring a higher density of first vias, a switchable circuit chip, and a conductive line layer that allows flexible control of electrical connections between vias and traces, enabling compatibility with various external components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the via arrangement on the substrate is customized for each external electrical component, then the compatibility with specific components is improved, but the development time and manufacturing cost increase
Solution Approach 1:
The substrate is designed with a universal via arrangement where the first vias can serve multiple functions: some are electrically connected to external components through the conductive line layer and switchable circuit chip, while others are electrically floating and can be configured for different purposes. This multi-functional design allows the same substrate to accommodate various external electrical components without customization, resolving the contradiction between versatility and development time.
Solution Approach 2:
The switchable circuit chip enables dynamic reconfiguration of electrical connections between the first vias and conductive traces. By controlling the switching states, the substrate can adapt its electrical connectivity pattern to match different external components in real-time, providing component-specific compatibility without requiring physical customization of the substrate for each component type.
2Adaptability or versatility
If the via arrangement on the substrate is customized for each external electrical component, then the compatibility with specific components is improved, but the manufacturing cost increases
Solution Approach 1:
The substrate employs a universal via arrangement where first vias can be configured for different purposes - some connected to external components, others electrically floating. This multi-functional design eliminates the need to manufacture different substrate variants for different components, significantly reducing manufacturing costs while maintaining compatibility with various external electrical components.
Solution Approach 2:
The switchable circuit chip provides dynamic reconfiguration capability, allowing a single substrate design to serve multiple component types through electronic switching rather than requiring multiple customized substrate versions. This reduces manufacturing complexity and cost while maintaining adaptability to different external components.
3Adaptability or versatility
If a higher density of first vias is used on the substrate, then the flexibility of electrical path configuration is improved, but the complexity of the substrate structure increases
Solution Approach 1:
The via system is segmented into two distinct types: first vias with higher density that provide flexible electrical path configuration options, and second vias with lower density that serve specific connection points. This segmentation allows the first vias to be used selectively for creating flexible electrical paths without requiring all vias to be high-density, thus managing overall substrate complexity while maintaining configuration flexibility.
Solution Approach 2:
The substrate applies different via densities in different regions: higher density first vias are distributed throughout the substrate to provide flexible electrical path options, while lower density second vias are placed at specific locations for component connections. This local quality approach optimizes the balance between electrical path flexibility and structural complexity by concentrating high-density vias only where needed for flexibility.
Data Source
AI summary
An electronic device includes a substrate, an outer layer, a conductive line layer, and a switchable circuit chip. The substrate has a plurality of having a plurality of first vias. The outer layer is disposed on a side of the substrate and has a plurality of second vias. The first vias have a larger distribution density or quantity than the second vias, so that a part of the first vias are electrically connected to the second vias, and another part of the first vias are electrically floating. The conductive line layer is disposed on the outer layer and has a plurality of conductive traces. The conductive traces are electrically connected to the second vias. The switchable circuit chip is electrically connected to the first vias. The conductive traces are electrically connected to the switchable circuit chip. The switchable circuit chip is configured for controlling an electrical connecting relationship between the conductive traces and the first vias and an electrical connecting relationship among the conductive traces.