Reconstituted Glass Panel Structure for Edge Damage Protection
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Solution Overview
Problem
Glass substrates in electronics packaging are fragile and prone to damage during handling and processing, requiring specialized toolsets that are not widely available, leading to high technology improvement costs for transitioning to high volume manufacturing.
Innovation Solution
Hybrid panels are developed, where a glass substrate is surrounded by an organic frame, with reinforcement strips to protect the glass and allow use of existing manufacturing tools, and reconstituted panels where glass cores are embedded in a dielectric layer within a frame, enabling efficient processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If glass substrates are used in electronics packaging, then substrate stiffness and electrical performance are improved, but the substrates become extremely vulnerable to edge damage during handling and processing
Solution Approach 1:
The glass substrate is divided into multiple glass units that are arranged in a grid pattern and separated by grooves. This segmentation reduces the size of individual glass pieces, making them less vulnerable to edge damage while maintaining the overall stiffness and performance benefits of glass material in the substrate structure.
Solution Approach 2:
A dielectric layer is introduced as an intermediary material that fills the grooves between adjacent glass units and bonds them together. This dielectric layer acts as a mediator that mechanically connects the fragile glass units while providing stress distribution and protection, enabling the glass substrate to be handled with existing tools without specialized equipment.
Data Source
AI summary
Embodiments disclosed herein include an apparatus that comprises a first layer with a first surface, a second surface, and a sidewall surface that couples the first surface to the second surface. In an embodiment, the first layer comprises a glass layer. In an embodiment, a second layer is on the first surface, the second surface, and the sidewall surface of the first layer. In an embodiment, the second layer is an organic dielectric material. In an embodiment, a third layer is on the second layer, and the third layer is a metallic material. In an embodiment, an edge of the third layer is substantially coplanar with an edge of the second layer.