Reconstituted Passive Assemblies for Stable Thick-Core Embedding
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Solution Overview
Problem
The integration of passive components like capacitors and inductors into the core of a package substrate is challenging due to thickness mismatches, leading to shifting and rotation during embedding, which complicates electrical contact and assembly processes.
Innovation Solution
The use of reconstituted substrate configurations with additional spacers and layers to match the core thickness, incorporating dielectric materials and filler particles to stabilize the components, and employing non-conductive films for improved bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If passive components are embedded directly into the core without thickness matching, then the core thickness requirement is met, but the components shift or rotate during embedding
Solution Approach 1:
The patent introduces an intermediary layer (dielectric material or filler particles) between the passive component and the core cavity wall. This intermediary acts as a thickness-matching spacer that absorbs the dimensional discrepancy between the component and the core, preventing shift and rotation during embedding while maintaining manufacturing precision without increasing overall assembly complexity
Solution Approach 2:
The patent modifies the physical parameters of the embedding environment by introducing materials with specific dielectric properties and filler particle compositions. By changing the material parameters (dielectric constant, viscosity, hardness) of the surrounding medium, the component remains stable during embedding without requiring complex mechanical constraints
2Reliability
If reconstituted substrate configurations with spacers and layers are used to match core thickness, then component stability is improved, but the assembly process becomes more complex
Solution Approach 1:
The patent applies preliminary action by pre-attaching the passive component to a carrier substrate before embedding. The carrier substrate is configured with spacers and dielectric layers in advance to match the core thickness, ensuring component stability during embedding. This preliminary preparation simplifies the actual embedding process by eliminating the need for complex real-time adjustments
Solution Approach 2:
The reconstituted substrate configuration is designed to be self-aligning and self-stabilizing during embedding. The spacers and dielectric layers automatically compensate for thickness variations and guide the component into the correct position without requiring external fixtures or complex alignment procedures, making the assembly process easier despite the enhanced structure
Data Source
AI summary
Embodiments disclosed herein include apparatuses with assemblies comprising passive electrical devices that are embedded in a core of a package substrate. In an embodiment, such an apparatus may comprise a substrate with a first surface, a second surface opposite from the first surface, and a sidewall surface coupling the first surface to the second surface. In an embodiment the substrate comprises a passive electrical device. In an embodiment, a pad is on the first surface of the substrate, and a layer contacts the substrate. In an embodiment, the layer directly contacts the first surface and the sidewall surface of the substrate.