Reconstituted Substrate Warpage Stiffness Measurement for Vacuum Adsorption
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate handling systems fail to account for substrate stiffness during vacuum adsorption, leading to vacuum leakage and adsorption errors due to unmeasured substrate stiffness, which is critical in semiconductor manufacturing where heterogeneous materials with different thermal expansion coefficients cause substrate warpage.
Innovation Solution
A reconstituted substrate stiffness measuring apparatus and system that includes a load cell sensor and push-pull gauge to measure warpage stiffness information by applying a force and measuring deformation at multiple positions, allowing for accurate stiffness determination and application to vacuum adsorption processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vacuum adsorption is performed without measuring substrate stiffness, then the handling process is simple, but vacuum leakage and adsorption errors occur due to unmeasured substrate stiffness
Solution Approach 1:
The patent applies preliminary action by measuring substrate stiffness and warpage values before vacuum adsorption occurs. The stiffness measuring apparatus quantifies substrate properties in advance, allowing the vacuum adsorption process to be adjusted based on pre-acquired data, thereby preventing vacuum leakage and adsorption errors.
Solution Approach 2:
The patent implements feedback by using the measured stiffness and warpage values to adjust vacuum adsorption parameters. The measurement results feed back into the control system, enabling dynamic adjustment of vacuum force and positioning parameters to match the actual substrate conditions, thus improving adsorption reliability.
2Force
If high vacuum force is applied to secure warped substrate, then substrate is firmly held, but substrate deformation increases causing adsorption errors
Solution Approach 1:
The patent applies parameter changes by adjusting vacuum adsorption force based on measured substrate stiffness values. Instead of using fixed high vacuum force, the system modifies the vacuum pressure parameter according to the actual substrate properties, ensuring sufficient holding force without excessive deformation.
Solution Approach 2:
The patent implements dynamics by making the vacuum adsorption process adaptive rather than static. The vacuum force is dynamically adjusted based on real-time measurement data of substrate stiffness and warpage, allowing the system to optimize the balance between holding force and substrate deformation for each individual substrate.
3Ease of operation
If substrate stiffness is not measured, then the handling process is simpler, but vacuum leakage occurs during handling
Solution Approach 1:
The patent applies preliminary action by measuring substrate stiffness before vacuum adsorption. This pre-measurement allows the system to prepare appropriate vacuum parameters in advance, ensuring reliable vacuum sealing without requiring complex real-time adjustments during the handling process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enables secure vacuum adsorption by adjusting vacuum force based on substrate stiffness, preventing leakage and improving equipment operability and yield by predicting and managing substrate deformation.
Implementation Method 1
a load cell configured to measure a force applied through the measuring tip to the reconstituted substrate in a vertical direction
Implementation Method 2
a push-pull gauge configured to measure a degree of deformation of the reconstituted substrate
Implementation Method 3
The reconstituted substrate that is bent is handled by a vacuum adsorption by a vacuum unit for performing subsequent processes
Data Source
AI summary
A warpage stiffness measuring apparatus includes a stage supporting a reconstituted substrate, a measuring unit configured to generate warpage stiffness information of the reconstituted substrate, and a moving unit configured to move the measuring unit to predetermined positions on the reconstituted substrate. The measuring unit includes a measuring tip, a load cell configured to measure a force applied through the measuring tip to the reconstituted substrate in a vertical direction, and a push-pull gauge configured to measure a degree of deformation of the reconstituted substrate. At each of the predetermined positions, the measuring tip contacts the reconstituted substrate, the load cell measures a force applied to the reconstituted substrate by the measuring tip, and the push-pull gauge measures a degree of deformation of the reconstituted substrate. The warpage stiffness information includes the force and the degree of deformation measured at each of the plurality of predetermined positions.