Reconstituted Wafer Embedding for Precise Multi-Die Positioning
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Solution Overview
Problem
Existing technologies face challenges in efficiently embedding multiple semiconductor dice in a single rigid mass while maintaining precise lateral and vertical positioning, which is crucial for forming functional integrated circuits.
Innovation Solution
A process involving a backing plate with adhesive to mount semiconductor dice, followed by encapsulation in a rigid mass, and precise grinding or polishing to expose terminals, enabling bumpless build-up layer processing for integrated circuit formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple semiconductor dice are embedded in a rigid mass using conventional mounting methods, then the quantity of integrated circuits is increased, but the lateral and vertical positioning precision deteriorates
Solution Approach 1:
The process segments the embedding operation into two distinct phases: first mounting multiple dice on a temporary flexible substrate with precise positioning, then transferring the entire array to the rigid mass as a unified structure. This segmentation allows precision to be established during mounting while the transfer operation maintains relative positions without requiring equivalent precision
Solution Approach 2:
A flexible substrate serves as an intermediary carrier between the dice and the rigid mass. The dice are first precisely positioned on this flexible substrate, which then acts as a pre-assembled unit for transfer to the final rigid mass positioner. This intermediary enables precise positioning to be achieved and preserved through the transfer process
2Device complexity
If conventional mounting processes are used to attach multiple dice, then the device complexity is reduced, but the productivity deteriorates due to multiple separate operations
Solution Approach 1:
Multiple individual dice mounting operations are merged into a single transfer operation. Instead of attaching each die separately to the rigid mass, the entire array of pre-positioned dice is transferred together in one operation, dramatically reducing the number of steps and improving productivity
3Stability of the object's composition
If the rigid mass is formed before dice embedding, then the structural stability is improved, but the ease of manufacture deteriorates due to difficulty in positioning
Solution Approach 1:
The conventional sequence is inverted: instead of embedding dice into an already-formed rigid mass, the dice are first mounted on a flexible substrate and then the rigid mass is formed around them or the array is transferred to it. This inversion makes the process easier by allowing flexible positioning during mounting while achieving the same structural stability in the final product
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures precise positional accuracy and enables the formation of a single rigid mass with exposed terminals, facilitating efficient integration of multiple dice into a system-in-package (SiP) apparatus.
Implementation Method 1
a backing plate with adhesive to mount semiconductor dice
Implementation Method 2
embedding multiple semiconductor dice in a single rigid mass
Implementation Method 3
precise grinding or polishing to expose terminals
Data Source
AI summary
A reconstituted wafer includes a rigid mass with a flat surface and a base surface disposed parallel planar to the flat surface. A plurality of dice are embedded in the rigid mass. The plurality dice include terminals that are exposed through coplanar with the flat surface. A process of forming the reconstituted wafer includes removing some of the rigid mass to expose the terminals, while retaining the plurality of dice in the rigid mass. A process of forming an apparatus includes separating one apparatus from the reconstituted wafer.