Reconstituted Wafer Mechanical Interlock for Die Adhesion
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Solution Overview
Problem
In microelectronics packaging, traditional reconstituted wafers face issues with die adhesion during processing and mechanical failure due to limited dual-sided processing capabilities, as they rely solely on mold material adhesion and have restricted design possibilities due to single-sided exposure and interconnect density limitations.
Innovation Solution
The system and method involve creating a reconstituted wafer with integrated circuit (IC) dies having two faces and sides, where the mold material surrounds the sides of the IC dies, mechanically interlocking them, and incorporating a redistribution layer with conductive paths and recessed conductive features to enhance adhesion and interconnect capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If dies are held in place solely by mold material adhesion, then manufacturing process is simple, but dies come loose during processing or mechanical failure in thermal cycle or shock testing
Solution Approach 1:
The mold material is segmented into multiple layers: a first mold material layer that is removed to create a cavity, and a second mold material layer that fills the cavity and provides mechanical interlocking features. This segmentation allows the mold material to serve both as a release layer and as a mechanical anchor, resolving the contradiction between manufacturing simplicity and adhesion reliability.
Solution Approach 2:
The invention transitions from a single-layer mold material structure to a multi-layer structure with vertical dimensionality. The cavity created by removing the first layer and filling it with the second layer adds depth to the mold material configuration, enabling mechanical interlocking features that prevent die loosening while maintaining manufacturing feasibility.
2Adaptability or versatility
If backside mold material is removed to expose backside face of the die, then dual-sided processing becomes possible, but die experiences mechanical failure due to pressure on either face
Solution Approach 1:
The mold material structure is designed beforehand to provide mechanical support and cushioning to the die. The cavity-filled structure with mechanical interlocking features is prepared in advance to prevent die failure during dual-sided processing, rather than adding support after the die is already exposed on both sides.
Solution Approach 2:
The invention uses composite material structures where the mold material is configured in a specific multi-layer arrangement with a cavity. This composite structure provides both the exposure needed for dual-sided processing and the mechanical support needed to prevent die failure, allowing versatility without sacrificing reliability.
3Productivity
If traditional redistribution layer is used to connect devices, then interconnect functionality is achieved, but number of incorporated devices and package complexity are limited by active face area and interconnect density
Solution Approach 1:
The invention utilizes the vertical dimension by creating a cavity within the mold material structure. This allows redistribution layers and conductive features to be positioned in three-dimensional space rather than being constrained to a single planar layer, thereby increasing the number of devices that can be incorporated without proportionally increasing package complexity.
Solution Approach 2:
The mold material structure is nested with a cavity that contains redistribution layers and conductive features. This nesting arrangement allows multiple functional elements to be integrated within the existing package structure, increasing device incorporation capacity while managing complexity through hierarchical organization.
Data Source
AI summary
A system and method. The system may include an integrated circuit (IC) die. The IC die may have two faces and sides. The system may further include mold material. The mold material may surround at least the sides of the IC die. The IC die may be mechanically interlocked with the mold material.