Reconstructed Package Substrate for High I/O at Lower Fabrication Cost
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Solution Overview
Problem
The high cost of large single substrates for package assemblies with high I/O counts poses a challenge, as they lead to increased fabrication costs and limited design flexibility, especially in high-performance computing applications.
Innovation Solution
A re-constructed package substrate is formed by combining multiple small, low-cost substrates with a redistribution layer (RDL) structure and molding material, creating a multi-substrate structure that mimics a larger substrate, allowing for better yield and cost-effectiveness while supporting high I/O counts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a large single substrate is used to provide high I/O counts, then the I/O capacity is improved, but the fabrication cost increases significantly
Solution Approach 1:
The package substrate is divided into multiple substrate portions (first substrate portion, second substrate portion, etc.) that are mounted on the RDL structure. Each substrate portion can be manufactured separately using standard fabrication processes, avoiding the need for expensive large-substrate fabrication while collectively providing high I/O capacity through the combined array of I/O terminals across all portions.
2Quantity of substance
If a large single substrate is used to provide high I/O counts, then the I/O capacity is improved, but the design flexibility is limited
Solution Approach 1:
By segmenting the substrate into multiple portions, the design becomes more flexible as each portion can be independently configured and optimized for specific functions. The RDL structure allows for redistribution of I/O terminals across different substrate portions, enabling various packaging configurations and improving adaptability to different design requirements while maintaining high I/O capacity.
Solution Approach 2:
The patent transitions from a planar large-substrate approach to a three-dimensional stacked configuration where multiple substrate portions are mounted vertically on the RDL structure. This dimensional change enables high I/O density without requiring a large footprint, thereby improving design flexibility for various application form factors while maintaining high I/O counts.
3Ease of manufacture
If multiple small substrates are combined to form a reconstructed substrate, then the fabrication cost is reduced, but the structural complexity increases
Solution Approach 1:
The RDL (redistribution layer) structure serves as an intermediary that simplifies the integration of multiple substrate portions. It provides a standardized mounting platform and interconnection architecture that manages the complexity of combining multiple substrates, enabling cost-effective manufacturing through modular assembly while handling the structural complexity through systematic interconnection design.
Data Source
AI summary
A package assembly includes a package substrate including a molding material layer and a plurality of substrate portions embedded in the molding material layer, a redistribution layer (RDL) structure on the package substrate, and a plurality of semiconductor devices on the RDL structure.