Recording Device Thermal Partition for Fanless Circuit Protection
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Solution Overview
Problem
In recording devices, particularly those used on materials like fabric, the floating mist and fluff from pretreatment agents can cause malfunctions by adhering to circuit substrates, leading to device failures.
Innovation Solution
A recording device design that includes a metal partition covering the circuit substrate, with the substrate in contact with a heat transfer section via an elastic member with high thermal conductivity, allowing efficient heat dissipation without the need for a blower fan.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a blower fan is used to cool the circuit substrate, then heat dissipation is improved, but floating matter may adhere to the circuit substrate causing malfunction
Solution Approach 1:
The patent extracts the harmful function of air blowing (which causes floating matter adhesion) while retaining the useful function of heat dissipation. The blower fan is replaced with a passive heat dissipation structure that does not involve air flow, thereby eliminating the source of the reliability problem while maintaining thermal management.
Solution Approach 2:
The patent introduces a heat dissipation fin structure as an intermediary between the circuit substrate and the surrounding environment. This fin structure serves as a mediator that transfers heat from the circuit substrate to the air through conduction and convection surfaces, without requiring direct air blowing onto the substrate, thus avoiding floating matter adhesion.
2Temperature
If the circuit substrate is exposed to air for cooling, then heat dissipation is improved, but floating matter adhesion increases
Solution Approach 1:
The patent replaces the mechanical air blowing system with a passive thermal conduction and convection system. Instead of using mechanical force (air flow) to remove heat, the system uses thermal conduction through the heat dissipation fin structure and natural convection from the fin surfaces, eliminating the mechanical disturbance that causes floating matter to adhere to the circuit substrate.
3Temperature
If a blower fan is installed for cooling, then heat dissipation capability is improved, but device complexity increases
Solution Approach 1:
The patent implements a self-service heat dissipation system where the heat dissipation fin structure passively dissipates heat from the circuit substrate without requiring external power or control systems. The structure utilizes natural convection and radiation from its extended surfaces, eliminating the need for powered fans, motors, or complex control circuits, thereby reducing device complexity while maintaining effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effective heat dissipation and protection from floating debris, preventing malfunctions while eliminating the requirement for a cooling fan, thus enhancing device reliability.
Implementation Method 1
the circuit substrate is in contact with a heat transfer section constituting at least a part of the partition via an elastic member having heat conductivity
Data Source
AI summary
A recording device includes a recording section configured to perform recording on a medium; a control substrate 60 configured to be involved in the operation of the recording section; and a storage section including a metal partition 70 and covering the control substrate 60, wherein the control substrate 60 is in contact with the convex member 72 constitutes at least a part of the partition 70 via the elastic member 80 having heat conductivity.