Liquid Jet Recording Head Voids Elimination
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Solution Overview
Problem
Conventional liquid jet recording heads face issues with bubble formation and retention in the recording liquid supply path, leading to defective liquid supply and droplet discharge, due to negative pressure, air infiltration, and residual gas, which obstructs the flow and requires complex bonding methods and suction recovery processes.
Innovation Solution
A liquid jet recording head design featuring a primary flow path forming member with a groove and a second flow path forming member that caps the groove, eliminating voids at the bonding section, allowing for a uniform and rectangular cross-section of the supply path, reducing bubble retention, and enabling efficient suction recovery with minimal frequency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bonding methods (ultrasonic wave welding, adhesive bonding) are used to join flow path forming members, then the recording liquid supply path can be formed, but voids are created at the bonding section which cause bubble formation and retention
Solution Approach 1:
The patent merges the bonding section with the flow path structure by designing the flow path forming members to overlap and bond directly without separate bonding sections. This integration eliminates voids between components, preventing bubble formation while maintaining reliable recording liquid supply through the continuous flow path.
2Reliability
If suction recovery processes are performed frequently to remove bubbles, then droplet discharge reliability improves, but operational complexity and time consumption increase
Solution Approach 1:
The patent extracts the bubble formation problem from the system by eliminating voids at the bonding section through direct overlapping bonding of flow path forming members. This preventive design removes the need for frequent suction recovery operations, reducing operational time while maintaining reliable droplet discharge.
3Ease of manufacture
If complex bonding structures with voids are used, then manufacturing is easier, but bubble retention occurs requiring additional suction recovery operations
Solution Approach 1:
The patent combines the bonding structure with the flow path structure, eliminating separate bonding sections and voids. This simplified design reduces manufacturing complexity while simultaneously reducing operational complexity by eliminating the need for frequent suction recovery procedures.
4Reliability
If negative pressure is maintained in the common liquid chamber to prevent leakage, then recording liquid containment improves, but air infiltration increases causing bubble formation
Solution Approach 1:
The patent eliminates voids at the bonding section through direct overlapping bonding, creating a sealed continuous flow path. This allows negative pressure to be maintained effectively for recording liquid containment without air infiltration, as there are no void spaces for air to enter and form bubbles.
Data Source
AI summary
A primary flow path forming member is provided with a groove which becomes a recording liquid supply path on a bottom surface thereof. A second flow path forming member is provided with an arm portion. The arm portion of the second flow path forming member is used as a cap for closing the opening of the groove which becomes the liquid supply path formed on the bottom surface of the prime flow path forming member. The primary flow path forming member and the second flow path forming member as described above are formed by injection-molding and bonded with each other by a bonding member. The bonding member is formed to cover a portion where the opening edge of the groove which becomes the recording liquid supply path, in the primary flow path forming member abuts on the arm portion of the second flow path forming member.