Recording Element Substrate Layout for Heat Dissipation Flatness
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Solution Overview
Problem
Conventional recording element substrates with multilayer wiring structures face issues of heat dissipation inefficiency and insulating film quality deterioration, leading to recesses that affect electro-thermal resistor thickness and current density, potentially reducing device lifespan.
Innovation Solution
A recording element substrate design with a heat dissipation plate in the same layer as the wiring layer, utilizing a two-layer insulating film structure comprising a lower insulating film and an upper insulating film to ensure flatness beneath the electro-thermal resistor, minimizing recesses and maintaining uniform heat generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the area of the heat dissipation plate is increased to improve heat dissipation, then heat dissipation efficiency is improved, but the distance between the electrical wiring and the heat dissipation plate decreases, causing insulating film quality to deteriorate and voids to form
Solution Approach 1:
The insulating film is divided into a first insulating film and a second insulating film formed at different times. The first insulating film is formed before the heat dissipation plate, and the second insulating film is formed after the heat dissipation plate to cover any voids or recesses created during heat dissipation plate formation, ensuring complete insulation without compromising heat dissipation efficiency
Solution Approach 2:
The first insulating film is formed in advance before the heat dissipation plate is created. This preliminary insulating layer provides a base layer that remains even when voids form later, ensuring that the electrothermal converter is always insulated from the wiring layer regardless of subsequent void formation
2Manufacturing precision
If the thickness of the insulating film is increased to prevent voids and improve film quality, then insulating film quality is improved, but the flatness beneath the electro-thermal resistor deteriorates, causing recesses to form
Solution Approach 1:
The insulating film structure is segmented into two distinct layers formed at different stages. The first layer provides baseline insulation, while the second layer is specifically deposited after heat dissipation plate formation to fill voids and maintain flatness, preventing recesses that would affect electrothermal converter uniformity
Solution Approach 2:
The first insulating film is deposited preliminarily before heat dissipation plate formation, establishing a foundation layer. This allows the second insulating film to be optimally deposited afterward to fill any voids without compromising the overall flatness required for electrothermal converter formation
3Use of energy by moving object
If the electro-thermal resistor film thickness is reduced to save power, then power consumption is reduced, but the device becomes more sensitive to insulating film recesses, leading to decreased uniformity of heat generation
Solution Approach 1:
The dual-layer insulating film structure acts as a cushioning mechanism that prevents recesses from forming in the first place. By ensuring a flat, void-free insulating surface through the two-stage formation process, the thin electrothermal converter is protected from thickness variations, maintaining uniform heat generation despite the reduced film thickness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances heat dissipation, maintains electro-thermal resistor thickness uniformity, and reduces local current density, resulting in a recording head with improved functionality and reliability.
Implementation Method 1
an electro-thermal resistor layer provided with an electro-thermal resistor that generates thermal energy to cause liquid stored in a liquid chamber to be ejected
Implementation Method 2
a heat dissipation plate formed in the same layer as the electrical wiring and provided beneath the electro-thermal resistor... to ensure proper dissipation of the thermal energy generated by the electro-thermal conversion elements
Data Source
AI summary
Provided is a recording element substrate including an electro-thermal resistor layer provided with an electro-thermal resistor, a wiring layer having an electrical wiring connected to the electro-thermal resistor and a heat dissipation plate disposed beneath the electro-thermal resistor are provided in the same layer, an insulating film for insulating the electro-thermal resistor and the electrical wiring, and a plug provided through the insulating film, the insulating film includes a planarized lower insulating film provided closer to the wiring layer and an upper insulating film provided on the lower insulating film, the upper insulating film is provided on the lower insulating film in a region beneath the electro-thermal resistor at least in the stacking direction, and the ratio of the distance between the electrical wiring and the heat dissipation plate to the thickness of the wiring layer is two or less.