Recording Element Substrate Logic Circuit Overlap Area Reduction
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Solution Overview
Problem
The existing semiconductor substrates face an area increase issue due to the growing number of memory elements, as they require additional space for logic circuits and wiring, which is not efficiently managed, especially when higher memory bits are needed for advanced recording apparatuses.
Innovation Solution
A recording element substrate design that incorporates a common signal supply circuit connecting first and second logic circuit arrays, allowing them to share signal lines, with the arrays arranged to overlap orthogonally, reducing the need for dedicated lines and minimizing the area occupied by logic circuits, thereby accommodating a larger number of memory elements without increasing the substrate's overall area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of memory elements is increased, then the memory capacity is improved, but the area of the semiconductor substrate increases due to additional logic circuits and wiring
Solution Approach 1:
The patent merges the signal supply paths for first and second logic circuit arrays by introducing a common signal supply circuit that shares signal lines between them. This consolidation reduces the total number of dedicated signal lines required, thereby decreasing the area occupied by wiring while supporting an increased number of memory elements.
Solution Approach 2:
The common signal supply circuit is designed to serve multiple logic circuit arrays simultaneously, making the signal lines universal rather than dedicated to a single array. This multi-functional approach allows the same signal lines to be reused across different logic circuit arrays, reducing overall wiring requirements and substrate area.
2Measurement precision
If dedicated signal lines are provided for each logic circuit array, then the control precision is improved, but the device complexity increases due to more wiring
Solution Approach 1:
The patent combines signal supply functions for multiple logic circuit arrays into a single common signal supply circuit. This merging approach maintains precise control over each array while reducing wiring complexity by eliminating redundant dedicated signal lines.
Solution Approach 2:
The patent introduces a new dimensional arrangement where logic circuit arrays are positioned to overlap in the planar view when observed from above. This spatial reorganization allows signal lines to be shared more efficiently between arrays, reducing wiring complexity while preserving control precision through the common signal supply architecture.
Data Source
AI summary
A recording element substrate includes a signal supply circuit and a common line which connects the signal supply circuit to first logic circuit array for a recording element and a second logic circuit array for a memory element in common. Furthermore, the first and second logic circuit arrays extend along a direction in which the common line extends, the first logic circuit array is disposed on one side of the common line, the second logic circuit array is disposed on the other side of the common line, and the first and second logic circuit arrays are arranged so that at least a portion of the first logic circuit array and a portion of the second logic circuit array overlap with each other in a direction orthogonal to the extending direction.