Substrate Arrangement in Recording Apparatus for Compact Design
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Solution Overview
Problem
Existing recording apparatuses face challenges in reducing size and thickness due to the arrangement of substrates on the outside of the mechanical component area, which complicates wiring operations and increases the overall size of the device.
Innovation Solution
The substrate is arranged between the base of the main apparatus body and the mechanism section, with relay substrates connected through wirings to secure connectors, allowing for a more compact design and simplified wiring operations by utilizing free spaces within the mechanical component arrangement area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the substrate is arranged on the outside of the mechanical component arrangement area, then the wiring operation space is secured, but the size of the recording apparatus increases
Solution Approach 1:
The substrate is arranged in the thickness direction (vertical arrangement) within the mechanical component arrangement area, transitioning from a planar layout to a three-dimensional configuration. This allows the substrate to be positioned between the base and the mechanism section, utilizing the vertical space rather than expanding the horizontal footprint, thereby reducing the overall size of the recording apparatus while maintaining wiring operation accessibility
Solution Approach 2:
The substrate is nested within the mechanical component arrangement area by positioning it between the base and the mechanism section. This nested arrangement allows the substrate to occupy the vertical space within the existing structural boundaries, effectively utilizing the internal volume of the apparatus without increasing its external dimensions
2Area of stationary object
If the substrate size is reduced, then the recording apparatus size is reduced, but the wiring operation space becomes insufficient
Solution Approach 1:
By arranging the substrate vertically in the thickness direction, the wiring operation space is created in the vertical dimension rather than requiring horizontal expansion. This allows wiring operations to be performed on the upper and lower surfaces of the substrate, effectively providing sufficient wiring space while maintaining a compact horizontal footprint
3Area of stationary object
If the substrate is arranged between the base and mechanism section, then the size and thickness are reduced, but the wiring operation becomes more difficult
Solution Approach 1:
The substrate is segmented into upper and lower surfaces, with wiring operations performed on both sides. This segmentation allows the wiring operations to be distributed across different surfaces, making them more accessible despite the vertical arrangement, and enables parallel processing of different wiring tasks
Data Source
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AI summary
A main substrate which is arranged in one end section of a main apparatus body in the width direction is horizontally arranged using a free space in one end section of the mechanical component arrangement area in a main apparatus body in the width direction. A plurality of relay substrates are vertically provided in the upper-side position of the main substrate in the mechanical component arrangement area, and the main substrate is connected to the plurality of relay substrates through FFCs connected to respective connectors. A plurality of connectors are provided on the two relay substrates in order to connect to wirings from a printer mechanism section.