Recording Element Wire Loop Geometry for Short-Circuit Prevention
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Solution Overview
Problem
Conventional wire bonding methods for connecting recording element substrates and wiring substrates in ink jet printers face challenges with short-circuits and poor insulation due to limited space in miniaturized devices, leading to increased manufacturing costs and reduced electrical reliability.
Innovation Solution
A recording element unit with a wire configuration featuring multiple bending points, specifically a first, second, and third bending point, adhering to specific height and distance relations, to enhance deformation resistance and prevent unintended contact between wires and other components, thereby improving electrical reliability and reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to connect recording element substrate and wiring substrate, then electrical connection is achieved, but short-circuits and poor insulation occur due to limited space in miniaturized devices
Solution Approach 1:
The wire is configured with multiple bending points (first, second, and third bending points) that extend into the vertical dimension, creating a three-dimensional loop structure. This dimensional transformation allows the wire to maintain adequate spacing from peripheral members and adjacent wires, preventing short-circuits and insulation failures while achieving reliable electrical connection in miniaturized devices.
Solution Approach 2:
The wire is formed into a curved loop configuration with specific bending points instead of a straight line. The curvature and loop structure provide spatial separation between the wire and other components, eliminating harmful contact while maintaining electrical connectivity. The specific geometric parameters (H1, L2, W3) define the curvature characteristics that prevent short-circuits.
2Stability of the object's composition
If support member such as wire loop is provided to support wire, then wire deformation is prevented, but manufacturing cost increases
Solution Approach 1:
The wire itself forms a self-supporting loop structure with multiple bending points that inherently maintains its shape and position. The wire's own geometry (with first, second, and third bending points at specific locations) provides the necessary support function, eliminating the need for separate support members and reducing manufacturing cost while preventing wire deformation.
Solution Approach 2:
The support function is merged into the wire structure itself by forming it as a loop with multiple bending points. The wire simultaneously performs both electrical connection and self-support functions, eliminating the need for additional support components and reducing overall device complexity and manufacturing cost.
3Ease of manufacture
If recording element substrate is downsized for manufacturing cost reduction, then manufacturing cost decreases, but space for support member becomes limited
Solution Approach 1:
The wire loop configuration utilizes vertical space and three-dimensional positioning rather than requiring additional horizontal area on the substrate. The multiple bending points create a compact 3D structure that fits within the limited footprint of downsized substrates, maintaining wire support functionality without increasing substrate area or manufacturing cost.
Data Source
AI summary
A recording element unit includes a first electrode pad, a second electrode pad, and a wire for electrically connecting the first electrode pad and the second electrode pad. The wire has a plurality of bending points at which the wire is bent in the direction of extension of the wire between a first connection point and a second connection point. The plurality of bending points include a first bending point at a height from the first connection point of at least 100 μm and not more than 200 μm, a second bending point at a distance from the first bending point in the horizontal direction of at least 100 μm and not more than 270 μm, and a third bending point at a distance from the intermediate point between the first electrode pad and the second electrode pad in the horizontal direction of within 150 μm.