Recovering Misaligned IC Die from Encapsulated Panels
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Solution Overview
Problem
In semiconductor packaging, misaligned encapsulated integrated circuit die on a panel often lead to the entire panel being discarded, resulting in significant financial loss due to the high cost of individual die, despite many die being otherwise good and reusable.
Innovation Solution
A process is developed to inspect and singulate misaligned integrated circuit die from a panel, minimizing the remaining encapsulant and reusing them in a new panel with proper alignment, using techniques like sawing or laser cutting, and subsequent encapsulation to form functional packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the entire panel is discarded due to misaligned die, then alignment quality is improved (by ensuring only properly aligned panels are used), but material waste and cost increase significantly
Solution Approach 1:
The panel is segmented into individual die units that can be separated and reused. Instead of discarding the entire panel due to misalignment of a few die, the system cuts the panel to extract properly aligned die as separate reusable components, while isolating the misaligned die for disposal or rework.
Solution Approach 2:
The system selectively discards only the misaligned die from the panel while recovering and reusing the properly aligned die. This partial discarding approach recovers valuable materials and reduces waste compared to discarding the entire panel, while still maintaining alignment quality standards for the reused die.
2Loss of substance
If misaligned die are removed and die are reused in a new panel, then material waste is reduced, but the process complexity increases
Solution Approach 1:
Alignment inspection is performed before the encapsulation process is completed. By detecting misaligned die early in the process while the panel is still accessible, the system enables subsequent separation and reuse operations without requiring complete encapsulation, thereby reducing overall process complexity.
Solution Approach 2:
The system uses automated optical inspection and programmed cutting mechanisms to identify and separate misaligned die. This replaces manual inspection and handling with automated systems that can precisely locate, cut, and reposition die, reducing the complexity of manual operations while enabling efficient die recovery and reuse.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This process allows for the reuse of good die, reducing material waste and costs by reusing otherwise discarded die, thereby minimizing material and environmental impact while maintaining the integrity of the semiconductor packages.
Implementation Method 1
singulation of the integrated circuit die can be performed by cutting the panel so that the amount of encapsulant remaining attached to each singulated die is minimized
Data Source
AI summary
A method for making a packaged integrated circuit is provided. The method includes making a first panel of encapsulated die. In some embodiments, if a threshold number of die are not positioned in proper positions in the first panel, the die are separated from the first panel. The separated die are subsequently encapsulated in other panels of encapsulated die. Conductive interconnects can be formed over the other panels. The other panels are then separated into integrated circuit packages.