Rectangular Flow Guide for Uniform Deposition and Chamber Cleaning
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Solution Overview
Problem
Existing semiconductor processing technologies face challenges in adjusting process parameters such as gas flow rates and pressures for deposition uniformity, particularly at low rotation speeds, high pressures, and low flow rates, and cleaning processing chamber components is difficult.
Innovation Solution
The implementation of a flow guide with a rectangular flow opening defined between flanges, allowing process and cleaning gases to flow over a substrate, and a process kit that includes openings for cleaning gases to access internal chamber volumes, facilitated by a substrate support and lamps, with a controller managing gas flow and cleaning operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional processing chamber components are used, then deposition can be performed, but adjusting process parameters (gas flow rates and pressures) for deposition uniformity is difficult
Solution Approach 1:
The flow guide includes adjustable flow control elements that allow dynamic adjustment of gas flow rates and pressures during deposition processes, enabling operators to optimize deposition uniformity by changing flow parameters without rotating the substrate or changing other process conditions
Solution Approach 2:
The system enables independent adjustment of multiple gas flow parameters (flow rates and pressures) through the flow guide structure, allowing optimization of deposition uniformity by changing gas flow parameters while maintaining other process conditions constant
2Manufacturing precision
If substrate rotation is used to improve deposition uniformity, then deposition quality improves, but adjustment difficulties increase
Solution Approach 1:
The flow guide structure extracts the flow control function from the substrate rotation system, allowing deposition uniformity to be achieved through optimized gas flow patterns rather than relying on substrate rotation, thereby simplifying the overall system by removing or reducing the need for rotation mechanisms
3Reliability
If cleaning operations are performed on processing chamber components, then component cleanliness improves, but access to internal volumes is difficult
Solution Approach 1:
The flow guide is designed as a segmented structure with multiple access points and openings that allow cleaning gases or liquids to reach internal surfaces through various pathways, enabling thorough cleaning of previously inaccessible areas without disassembling the entire chamber
Solution Approach 2:
The flow guide structure acts as an intermediary that directs cleaning fluids or gases into internal chamber volumes through its openings and flow paths, facilitating cleaning of hard-to-reach surfaces without requiring direct physical access to those areas
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances deposition uniformity and facilitates cleaning at high pressures and low flow rates, mitigating the effects of substrate rotation and improving operational efficiency and cost-effectiveness.
Implementation Method 1
One or more process gases flow through a rectangular flow opening while flowing over a substrate to form one or more layers on the substrate
Implementation Method 2
The flow guide includes one or more openings that can be closed and opened to allow one or more cleaning gases to flow into an internal volume defined at least partially by a window
Implementation Method 3
a plurality of lamp
Data Source
AI summary
The present disclosure relates to flow guides, process kits, and related methods for processing chambers to facilitate deposition process adjustability. In one implementation, a flow guide includes a middle plate having a first side and a second side opposing the first side along a first direction. The first side and the second side are arcuate. The flow guide includes a first flange extending outwardly relative to a third side of the middle plate and outwardly relative to an outer face of the middle plate, and a second flange extending outwardly relative to a fourth side of the middle plate and outwardly relative to the outer face of the middle plate. The fourth side opposes the third side along a second direction that intersects the first direction. The flow guide includes a rectangular flow opening defined between the first flange and the second flange.