Rectangular Bond Force Concentrator for Low-Stress Substrate Bonding
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Solution Overview
Problem
Existing semiconductor manufacturing processes face challenges in achieving reliable substrate bonding, which can lead to unsuccessful encapsulation and waste of preceding manufacturing processes if issues occur.
Innovation Solution
The method involves using a rectangular bond force concentrator to apply high pressure to the bonding area of substrates, allowing for improved bonding by concentrating force and reducing material costs through thinner layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bonding methods are used to join substrates, then the bonding process can be completed, but the bonding reliability is insufficient and may lead to unsuccessful encapsulation
Solution Approach 1:
The patent introduces a bond force concentrator with a specific geometric shape (e.g., protrusion or recess) that concentrates the bonding force to a localized area. This local quality enhancement creates a high-stress zone that ensures reliable bond formation at the critical bonding interface, while the rest of the substrate maintains its original structure. The localized force concentration improves bonding reliability without requiring increased force across the entire substrate area, thus maintaining production efficiency.
Solution Approach 2:
The patent modifies the bonding interface geometry by introducing a bond force concentrator that changes the stress distribution parameters. The concentrator creates a localized high-stress region with optimized pressure and force distribution, transforming the bonding process from uniform low-stress contact to focused high-stress bonding. This parameter change enables reliable bonding while controlling the overall force application, preventing substrate damage and maintaining productivity.
2Reliability
If high pressure is applied to the bonding area to improve bonding, then bonding reliability improves, but residual stress increases
Solution Approach 1:
The bond force concentrator applies high pressure only to the localized bonding interface area where it is needed for reliable bond formation. The geometric design (protrusion or recess) ensures that the high stress is confined to the bonding zone, while the surrounding substrate areas experience minimal or no additional stress. This localized quality approach achieves bonding reliability without generating excessive residual stress across the entire substrate.
Solution Approach 2:
The patent segments the stress distribution by introducing a bond force concentrator that separates the high-stress bonding zone from the low-stress substrate areas. The concentrator acts as a stress isolation element, allowing high pressure to be applied precisely where needed for bonding while protecting the rest of the substrate from harmful residual stress. This segmentation enables reliable bonding with controlled stress management.
3Reliability
If substrate bonding is unsuccessful, then the encapsulation fails, but the preceding manufacturing processes are wasted
Solution Approach 1:
The bond force concentrator is designed as a preventive measure that ensures bonding success before encapsulation begins. By concentrating and optimizing the bonding force at the interface, the concentrator pre-establishes a reliable bond that prevents encapsulation failure. This beforehand cushioning approach guarantees bonding reliability, ensuring that the subsequent encapsulation process succeeds and preventing waste of manufacturing materials and processes.
4Ease of manufacture
If existing bonding technologies are used, then the process can be completed, but integration complexity increases
Solution Approach 1:
The bond force concentrator is integrated directly into the substrate structure itself, merging the bonding function with the substrate geometry. Rather than requiring separate bonding apparatus or complex multi-step processes, the concentrator is formed as part of the substrate fabrication (through protrusions, recesses, or geometric features), combining structure creation and bonding preparation into a single integrated process. This merging reduces device complexity and improves ease of manufacture while maintaining effective bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances bonding efficiency, reduces the risk of residual stress, and allows for easier integration into existing processes, while also enabling wafer-level packaging and hermetical sealing.
Implementation Method 1
using a rectangular bond force concentrator to apply high pressure to the bonding area of substrates, allowing for improved bonding by concentrating force
Data Source
AI summary
Herein is provided a method for bonding a first substrate with a second substrate, comprising the steps of: providing a first and a second substrate, and bonding the first substrate and the second substrate together using a rectangular bond force concentrator to form a bond, wherein the first substrate or the second substrate comprises a device. Herein is further provided an apparatus comprising a first substrate and a second substrate bonded together using a rectangular bond force concentrator to form a bond. Herein is further provided a use of a bond force concentrator in bonding a first substrate and a second substrate to form a bond.